EP3SL70F484C2 vs EP3SL70F484C2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F484C2 sa pamamagitan ng Intel at EP3SL70F484C2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F484C2 | EP3SL70F484C2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Series | Stratix III L | — |
| Family | Stratix III L FPGA | Stratix III L (logic-rich) |
| Logic Elements | 67,500 | 67,500 |
| Embedded Memory | 2,699,264 bits | — |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| User I/O Count | 296 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm |
| Maximum Core Frequency | 600 MHz | — |
| Package Type | 484-ball FC-FBGA (FineLine BGA) | — |
| Package Pin Count | 484 | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | — |
| Speed Grade | C2 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Total Embedded Memory | — | 2,699,264 bits |
| User I/Os | — | 296 |
| Fabric Speed (max) | — | 600 MHz |
| Packhaging | — | 484-ball FC-FBGA |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (C2 grade) | — | 0C to +85C |
| Level ng MSL | — | 3 |
| Lead-Free / Pb-Free Reflow | — | Yes |