EP3SL70F780C2G vs EP3SL50F780C2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780C2G disebabkan oleh Intel dan EP3SL50F780C2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL70F780C2G | EP3SL50F780C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | — |
| Embedded Memory | 2,699,264 bits | — |
| User I/O Count | 488 | — |
| Kemasan | 780-ball FCBGA (FineLine BGA) | 780-ball FCBGA (Flip-Chip BGA) |
| Speed Grade | C2 (medium) | — |
| Temperature Grade | Commercial (0 C to 85 C) | — |
| Process Node | 40 nm low-power CMOS | — |
| Core Voltage (VCC) | 0.9 V | — |
| DSP Blocks | Yes (dedicated) | — |
| Memory Interfaces Supported | DDR3, DDR2, QDR II+, RLDRAM II | — |
| PCIe Hard IP | Gen1/Gen2 | — |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | — |
| PLLs | Fractional PLLs | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory (bits) | — | 2,184,192 |
| Maximum User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Process Technology | — | 65 nm |
| Suhu Operasi | — | 0°C to +85°C (commercial) |
| Maximum Core Frequency | — | 600 MHz |
| Configuration Interface | — | JTAG / passive serial / fast passive parallel |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces |
| Embedded Memory Type | — | TriMatrix (MLAB, M9K, M144K blocks) |