EP3SL70F780C2G vs EP3SL50F780C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780C2G sa pamamagitan ng Intel at EP3SL50F780C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F780C2G | EP3SL50F780C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | — |
| Embedded Memory | 2,699,264 bits | — |
| User I/O Count | 488 | — |
| Packhaging | 780-ball FCBGA (FineLine BGA) | 780-ball FCBGA (Flip-Chip BGA) |
| Speed Grade | C2 (medium) | — |
| Temperature Grade | Commercial (0 C to 85 C) | — |
| Process Node | 40 nm low-power CMOS | — |
| Core Voltage (VCC) | 0.9 V | — |
| DSP Blocks | Yes (dedicated) | — |
| Memory Interfaces Supported | DDR3, DDR2, QDR II+, RLDRAM II | — |
| PCIe Hard IP | Gen1/Gen2 | — |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | — |
| PLLs | Fractional PLLs | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory (bits) | — | 2,184,192 |
| Maximum User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Process Technology | — | 65 nm |
| Temperature na Operasyon | — | 0°C to +85°C (commercial) |
| Maximum Core Frequency | — | 600 MHz |
| Configuration Interface | — | JTAG / passive serial / fast passive parallel |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces |
| Embedded Memory Type | — | TriMatrix (MLAB, M9K, M144K blocks) |