EP4CE55F29C9L vs EP4CE55F23C9L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE55F29C9L disebabkan oleh Intel dan EP4CE55F23C9L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE55F29C9L | EP4CE55F23C9L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | — |
| Logic Array Blocks (LABs) | 3,491 | — |
| Total RAM Bits | 2,396,160 | — |
| Embedded 18x18 Multipliers | 154 | 156 |
| PLLs | 4 | 4 |
| User I/Os | 374 | 324 |
| Kemasan | 780-ball FBGA (F29) | 484-ball FBGA (F23) |
| Speed Grade | 9 (C9 - commercial) | C9 (fastest commercial/industrial) |
| Suhu Operasi | 0C to +85C (commercial) | -40C to +85C (industrial) |
| Process Technology | 60 nm low-power | — |
| Supply Voltage (Core) | 1.2 V | — |
| Configuration Method | JTAG / AS / PS / FPP | SRAM-based, requires external flash |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory | — | 2,396,160 bits (2.5 Mbit) |
| Process Node | — | 60 nm low-power |
| Core Voltage | — | 1.2 V (typical) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |