EP4CE55F29C9L vs EP4CE55F23C9L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F29C9L sa pamamagitan ng Intel at EP4CE55F23C9L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE55F29C9L | EP4CE55F23C9L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 | — |
| Logic Array Blocks (LABs) | 3,491 | — |
| Total RAM Bits | 2,396,160 | — |
| Embedded 18x18 Multipliers | 154 | 156 |
| PLLs | 4 | 4 |
| User I/Os | 374 | 324 |
| Packhaging | 780-ball FBGA (F29) | 484-ball FBGA (F23) |
| Speed Grade | 9 (C9 - commercial) | C9 (fastest commercial/industrial) |
| Temperature na Operasyon | 0C to +85C (commercial) | -40C to +85C (industrial) |
| Process Technology | 60 nm low-power | — |
| Supply Voltage (Core) | 1.2 V | — |
| Configuration Method | JTAG / AS / PS / FPP | SRAM-based, requires external flash |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory | — | 2,396,160 bits (2.5 Mbit) |
| Process Node | — | 60 nm low-power |
| Core Voltage | — | 1.2 V (typical) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |