EP4CGX110DF31C8N vs EP4CGX110DF27I7N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CGX110DF31C8N disebabkan oleh Intel dan EP4CGX110DF27I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP4CGX110DF31C8N EP4CGX110DF27I7N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Cyclone IV GX —
Logic Elements 109,424 —
Logic Array Blocks (LABs) 6,839 6,422
Embedded Memory Bits 5,621,760 (approximately 702 Kbits) —
Embedded Memory Blocks M9K blocks, 9-bit parity —
DSP Blocks (18x18 Multipliers) 264 multipliers —
Maximum User I/Os 475 —
I/O Banks 8 —
PLLs 4 general-purpose PLLs 4
Transceivers 8 high-speed transceivers up to 3.125 Gbps 8 channels, up to 3.125 Gbps
PCI Express Hard IP PCIe Gen1/Gen2 x1/x2/x4 —
Core Supply Voltage 1.2 V —
Process Technology 60 nm low-power CMOS —
Kemasan 896-ball FineLine BGA (F31), 31 mm 672-ball FBGA, 1.0 mm pitch
Operating Temperature (Commercial) 0C to 85C —
Speed Grade 8 —
Configuration SRAM-based, supports AS, PS, JTAG, FPP —
Status RoHS Compliant Compliant
Series — Cyclone IV GX
Device Family — EP4CGX110
Logic Elements (LEs) — 109,424
Embedded Memory (bits) — 5,621,760
Memory Blocks (M9K) — 610
Embedded 18x18 Multipliers — 280
User I/Os — 393
PCIe Hard IP Blocks — 4 (Gen1 x1/x2/x4)
Core Voltage — 1.2 V
Suhu Operasi — -40C to +100C (Industrial)
Jenis Pemasangan — Surface Mount
Process Node — 60 nm
Configuration Scheme — AS, PS, JTAG, FPP

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