EP4CGX110DF31C8N vs EP4CGX110DF27I7N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX110DF31C8N sa pamamagitan ng Intel at EP4CGX110DF27I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4CGX110DF31C8N EP4CGX110DF27I7N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone IV GX —
Logic Elements 109,424 —
Logic Array Blocks (LABs) 6,839 6,422
Embedded Memory Bits 5,621,760 (approximately 702 Kbits) —
Embedded Memory Blocks M9K blocks, 9-bit parity —
DSP Blocks (18x18 Multipliers) 264 multipliers —
Maximum User I/Os 475 —
I/O Banks 8 —
PLLs 4 general-purpose PLLs 4
Transceivers 8 high-speed transceivers up to 3.125 Gbps 8 channels, up to 3.125 Gbps
PCI Express Hard IP PCIe Gen1/Gen2 x1/x2/x4 —
Core Supply Voltage 1.2 V —
Process Technology 60 nm low-power CMOS —
Packhaging 896-ball FineLine BGA (F31), 31 mm 672-ball FBGA, 1.0 mm pitch
Operating Temperature (Commercial) 0C to 85C —
Speed Grade 8 —
Configuration SRAM-based, supports AS, PS, JTAG, FPP —
Tindminan RoHS Compliant Compliant
Series — Cyclone IV GX
Device Family — EP4CGX110
Logic Elements (LEs) — 109,424
Embedded Memory (bits) — 5,621,760
Memory Blocks (M9K) — 610
Embedded 18x18 Multipliers — 280
User I/Os — 393
PCIe Hard IP Blocks — 4 (Gen1 x1/x2/x4)
Core Voltage — 1.2 V
Temperature na Operasyon — -40C to +100C (Industrial)
Uri ng Pagpapasok — Surface Mount
Process Node — 60 nm
Configuration Scheme — AS, PS, JTAG, FPP

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