EP4SGX530HH35C3 vs EP4SGX530HH35C4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX530HH35C3 disebabkan oleh Intel dan EP4SGX530HH35C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX530HH35C3 | EP4SGX530HH35C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | — |
| Logic Elements (LE) | 531,200 | — |
| LABs / CLBs | 21,248 | — |
| Total RAM Bits | 28,033,024 | — |
| User I/O Count | 564 | — |
| Kemasan | 1152-BBGA / FCBGA (HFBGA) | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) |
| Core Voltage | 0.87 V to 0.93 V | — |
| Process Technology | 40 nm CMOS | 40 nm |
| Transceivers | 24 channels, up to 8.5 Gbps | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] |
| DSP Blocks | 1024 (18x18 multipliers) | [DATA_NEEDED: block count for this density] |
| Suhu Operasi | 0C to +85C (Commercial) | 0 C to 85 C (Commercial, -C4 suffix) |
| Speed Grade | C3 | HH35 |
| Jenis Pemasangan | Surface Mount | Surface Mount (flip-chip BGA) |
| Status RoHS | Compliant | Compliant |
| Device Type | — | FPGA |
| Logic Elements | — | 531,200 |
| Adaptive Logic Modules (ALMs) | — | 21,248 LABs / 212,480 equivalent LEs |
| Embedded Memory (bits) | — | 28,033,024 |
| Maximum User I/O Pins | — | 564 |
| Core Supply Voltage | — | 0.9 V |
| PLLs | — | 8 fractional PLLs |
| Aras MSL | — | MSL3 (per BGA package standard) |