EP4SGX530KH40C3 vs EP4SGX530KH40C2N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX530KH40C3 disebabkan oleh Intel dan EP4SGX530KH40C2N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP4SGX530KH40C2N - 531K LEs Stratix IV GX FPGA, 1517-FCBGA | Intel
EP4SGX530KH40C2N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP4SGX530KH40C3 | EP4SGX530KH40C2N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 531,200 | 531,200 |
| Configurable Logic Blocks (CLBs) | 212,480 | — |
| Embedded Memory (bits) | 28,033,024 | — |
| Embedded Memory (Mbits) | 28,033,024 / 8 ≈ 3,504 KBytes | — |
| Maximum User I/O | 744 | — |
| Transceivers | Up to 48 channels | Up to 48 (GX) |
| Transceiver Data Rate | Up to 8.5 Gbps | — |
| Hard PCIe Gen2 Endpoint | Yes | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: count] | — |
| PLLs | 12 (typical) | — |
| Kemasan | 1517-BBGA, FCBGA | 1517-ball FCBGA (KH40) |
| Package Pin Count | 1517 balls | — |
| Ball Pitch | 1.0 mm (typical for FCBGA-1517) | — |
| Process Node | 40 nm CMOS | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Speed Grade | C3 | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Logic Array Blocks (LABs) | — | 21,248 |
| Embedded Memory Bits | — | 28,033,024 |
| Adaptive Logic Modules (ALMs) | — | 212,480 |
| DSP Blocks | — | 24 |
| 18x18 Multipliers | — | 1,024 |
| Maximum User I/O Pins | — | 744 |
| Maximum Transceiver Data Rate | — | 8.5 Gbps |
| PCI Express Hard IP Blocks | — | 4 |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Suhu Operasi | — | -40C to +100C (industrial) |