EP4SGX530KH40C3 vs EP4SGX530KH40C2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX530KH40C3 sa pamamagitan ng Intel at EP4SGX530KH40C2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4SGX530KH40C2N - 531K LEs Stratix IV GX FPGA, 1517-FCBGA | Intel
EP4SGX530KH40C2N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP4SGX530KH40C3 | EP4SGX530KH40C2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 531,200 | 531,200 |
| Configurable Logic Blocks (CLBs) | 212,480 | — |
| Embedded Memory (bits) | 28,033,024 | — |
| Embedded Memory (Mbits) | 28,033,024 / 8 ≈ 3,504 KBytes | — |
| Maximum User I/O | 744 | — |
| Transceivers | Up to 48 channels | Up to 48 (GX) |
| Transceiver Data Rate | Up to 8.5 Gbps | — |
| Hard PCIe Gen2 Endpoint | Yes | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: count] | — |
| PLLs | 12 (typical) | — |
| Packhaging | 1517-BBGA, FCBGA | 1517-ball FCBGA (KH40) |
| Package Pin Count | 1517 balls | — |
| Ball Pitch | 1.0 mm (typical for FCBGA-1517) | — |
| Process Node | 40 nm CMOS | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Speed Grade | C3 | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Logic Array Blocks (LABs) | — | 21,248 |
| Embedded Memory Bits | — | 28,033,024 |
| Adaptive Logic Modules (ALMs) | — | 212,480 |
| DSP Blocks | — | 24 |
| 18x18 Multipliers | — | 1,024 |
| Maximum User I/O Pins | — | 744 |
| Maximum Transceiver Data Rate | — | 8.5 Gbps |
| PCI Express Hard IP Blocks | — | 4 |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Temperature na Operasyon | — | -40C to +100C (industrial) |