EP4SGX70DF29I4N vs EP4SGX70DF29I3G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX70DF29I4N disebabkan oleh Intel dan EP4SGX70DF29I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP4SGX70DF29I4N EP4SGX70DF29I3G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Aktif
Family Stratix IV GX —
Logic Elements 72,600 —
Logic Array Blocks (LABs/CLBs) 2,904 —
Total RAM Bits 7,564,880 —
User I/Os 372 —
Core Voltage 0.9 V —
Process Technology 40 nm 40 nm
Kemasan 780-BBGA, FC-FBGA (DF29), 29 x 29 mm —
Suhu Operasi -40C to +100C (industrial) —
Speed Grade I4 -3
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Lead-Free / RoHS Yes (lead free per supplier listings) —
Cell Count 72,600 cells —
Maximum Frequency 717 MHz —
Supplier Package Code FBGA-780 (DF29) —
Series — Stratix IV GX
Logic Elements (LE) — 72,600
Embedded Memory Bits — 7,564,880 (about 7.5 Mbit)
Embedded Memory Blocks — 72600
Number of Logic Cells / Arrays — 372
Number of User I/O Pins — 372
Number of Transceiver Channels — [DATA_NEEDED: exact channel count for this device]
Transceiver Data Rate — [DATA_NEEDED: per-channel data rate]
Package Type — 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip)
Package Code — DF29
Operating Temperature Grade — Industrial (I3)
Junction Temperature Range — -40C to +100C
Core Supply Voltage — 0.87 V to 0.93 V
Aras MSL — [DATA_NEEDED: MSL rating]
Status RoHS — Compliant
Boson Bebas — [DATA_NEEDED: halogen-free claim]

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