EP4SGX70DF29I4N vs EP4SGX70DF29I3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX70DF29I4N sa pamamagitan ng Intel at EP4SGX70DF29I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP4SGX70DF29I3G EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

EP4SGX70DF29I3G ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro EP4SGX70DF29I4N EP4SGX70DF29I3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Family Stratix IV GX —
Logic Elements 72,600 —
Logic Array Blocks (LABs/CLBs) 2,904 —
Total RAM Bits 7,564,880 —
User I/Os 372 —
Core Voltage 0.9 V —
Process Technology 40 nm 40 nm
Packhaging 780-BBGA, FC-FBGA (DF29), 29 x 29 mm —
Temperature na Operasyon -40C to +100C (industrial) —
Speed Grade I4 -3
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Lead-Free / RoHS Yes (lead free per supplier listings) —
Cell Count 72,600 cells —
Maximum Frequency 717 MHz —
Supplier Package Code FBGA-780 (DF29) —
Series — Stratix IV GX
Logic Elements (LE) — 72,600
Embedded Memory Bits — 7,564,880 (about 7.5 Mbit)
Embedded Memory Blocks — 72600
Number of Logic Cells / Arrays — 372
Number of User I/O Pins — 372
Number of Transceiver Channels — [DATA_NEEDED: exact channel count for this device]
Transceiver Data Rate — [DATA_NEEDED: per-channel data rate]
Package Type — 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip)
Package Code — DF29
Operating Temperature Grade — Industrial (I3)
Junction Temperature Range — -40C to +100C
Core Supply Voltage — 0.87 V to 0.93 V
Level ng MSL — [DATA_NEEDED: MSL rating]
Tindminan RoHS — Compliant
Wala sa Halogen — [DATA_NEEDED: halogen-free claim]

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