EP4SGX70DF29I4N vs EP4SGX70DF29I3G 比較

詳細並排比較 EP4SGX70DF29I4N 由 Intel 與 EP4SGX70DF29I3G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP4SGX70DF29I3G EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

EP4SGX70DF29I3G ✓ 啟用中

規格比較

參數 EP4SGX70DF29I4N EP4SGX70DF29I3G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 啟用中
Family Stratix IV GX —
Logic Elements 72,600 —
Logic Array Blocks (LABs/CLBs) 2,904 —
Total RAM Bits 7,564,880 —
User I/Os 372 —
Core Voltage 0.9 V —
Process Technology 40 nm 40 nm
封裝 780-BBGA, FC-FBGA (DF29), 29 x 29 mm —
工作溫度 -40C to +100C (industrial) —
Speed Grade I4 -3
安裝類型 Surface Mount Surface Mount (BGA)
Lead-Free / RoHS Yes (lead free per supplier listings) —
Cell Count 72,600 cells —
Maximum Frequency 717 MHz —
Supplier Package Code FBGA-780 (DF29) —
Series — Stratix IV GX
Logic Elements (LE) — 72,600
Embedded Memory Bits — 7,564,880 (about 7.5 Mbit)
Embedded Memory Blocks — 72600
Number of Logic Cells / Arrays — 372
Number of User I/O Pins — 372
Number of Transceiver Channels — [DATA_NEEDED: exact channel count for this device]
Transceiver Data Rate — [DATA_NEEDED: per-channel data rate]
Package Type — 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip)
Package Code — DF29
Operating Temperature Grade — Industrial (I3)
Junction Temperature Range — -40C to +100C
Core Supply Voltage — 0.87 V to 0.93 V
MSL 等級 — [DATA_NEEDED: MSL rating]
RoHS 狀態 — Compliant
無鹵素 — [DATA_NEEDED: halogen-free claim]

資料表與資源

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