EPF10K200EGC599-1 vs EPF10K200EFC672-3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K200EGC599-1 disebabkan oleh Intel dan EPF10K200EFC672-3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EPF10K200EGC599-1 EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera

EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera

EPF10K200EGC599-1 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EPF10K200EGC599-1 EPF10K200EFC672-3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Obsolete
Family FLEX 10KE —
Logic Elements (LEs) 9,984 —
Typical Gates 200,000 —
Embedded Array Blocks (EABs) 470 —
Total RAM Bits 98,304 98,304 bits (12 EABs of 8 Kbits)
Core Supply Voltage 2.375 V to 2.625 V —
I/O Voltage Tolerance 5.0 V tolerant —
Kiraan Pin 599 —
Package Type 599-BCPGA (Ceramic Pin Grid Array) —
Package Dimensions 62.48 x 62.48 mm —
Jenis Pemasangan Through-Hole (Socket or Solder) Surface Mount
Suhu Operasi 0C to +70C (Commercial) 0 °C to +70 °C (commercial)
Programming Interface JTAG (IEEE 1149.1) —
PLLs 4 —
Status RoHS [DATA_NEEDED: RoHS status of ceramic CPGA variant] [DATA_NEEDED: rohs status]
Series — FLEX 10KE
Number of Logic Elements / Cells — 9,984
Number of LABs / CLBs — 1248
Number of I/O — 470
Number of Gates (typical) — 200,000
Supply Voltage - Operating — 2.3 V to 2.7 V (2.5 V nominal)
Process Technology — 0.22 µm CMOS
Maximum Operating Frequency — 166.67 MHz
Propagation Delay — 0.4 ns
Kemasan / Case — 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
Configuration Memory — SRAM-based (volatile, requires external configuration device)
Number of PLLs — 4
Aras MSL — [DATA_NEEDED: MSL level]
Lead-Free — [DATA_NEEDED: lead-free status]

Laporan Datasheet & Sumber

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