EPF10K200EGC599-1 vs EPF10K200EFC672-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EGC599-1 sa pamamagitan ng Intel at EPF10K200EFC672-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200EGC599-1 EPF10K200EFC672-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Obsolete
Family FLEX 10KE —
Logic Elements (LEs) 9,984 —
Typical Gates 200,000 —
Embedded Array Blocks (EABs) 470 —
Total RAM Bits 98,304 98,304 bits (12 EABs of 8 Kbits)
Core Supply Voltage 2.375 V to 2.625 V —
I/O Voltage Tolerance 5.0 V tolerant —
Bilang ng Pin 599 —
Package Type 599-BCPGA (Ceramic Pin Grid Array) —
Package Dimensions 62.48 x 62.48 mm —
Uri ng Pagpapasok Through-Hole (Socket or Solder) Surface Mount
Temperature na Operasyon 0C to +70C (Commercial) 0 °C to +70 °C (commercial)
Programming Interface JTAG (IEEE 1149.1) —
PLLs 4 —
Tindminan RoHS [DATA_NEEDED: RoHS status of ceramic CPGA variant] [DATA_NEEDED: rohs status]
Series — FLEX 10KE
Number of Logic Elements / Cells — 9,984
Number of LABs / CLBs — 1248
Number of I/O — 470
Number of Gates (typical) — 200,000
Supply Voltage - Operating — 2.3 V to 2.7 V (2.5 V nominal)
Process Technology — 0.22 µm CMOS
Maximum Operating Frequency — 166.67 MHz
Propagation Delay — 0.4 ns
Packhaging / Kaso — 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
Configuration Memory — SRAM-based (volatile, requires external configuration device)
Number of PLLs — 4
Level ng MSL — [DATA_NEEDED: MSL level]
Lead-Free — [DATA_NEEDED: lead-free status]

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