EPM2210GF324C5 vs EPM2210GF324C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM2210GF324C5 disebabkan oleh Intel dan EPM2210GF324C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EPM2210GF324C5 - MAX II 2210 LE CPLD, 324-BGA, 5ns | Intel/Altera
EPM2210GF324C5 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EPM2210GF324C5 | EPM2210GF324C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Family | MAX II | MAX II |
| Device Name | EPM2210 | — |
| Logic Elements (LE) | 2,210 | — |
| Equivalent Macrocells | 1,700 | 1,700 |
| Maximum User I/Os | 272 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Pin-to-Pin Delay (tPD1) | 5 ns (C5 speed grade) | — |
| Internal Performance | 304 MHz | — |
| Core Voltage (VCCINT) | 1.8 V | — |
| I/O Voltage (VCCIO) - MultiVolt | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 6-layer-metal flash, 0.18 um | 0.18 µm 6-layer-metal flash |
| Suhu Hubungan Operasi | 0C to +85C (commercial) | — |
| Kemasan | 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm | 324-ball FineLine BGA (GF324) |
| In-System Programmability | JTAG (IEEE 1149.1) | — |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Status RoHS | Compliant (lead-free) | Compliant |
| Device Type | — | CPLD (Complex Programmable Logic Device) |
| Logic Elements | — | 2,210 |
| User I/Os (max) | — | 272 |
| Supply Voltage - Core (VCCINT) | — | 1.8 V |
| MultiVolt I/O Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Maximum Internal Frequency | — | 247.5 MHz |
| Pin-to-Pin Logic Delay (tPD) | — | 7.0 ns (C4 speed grade) |
| Programming Interface | — | IEEE 1149.1 JTAG (ISP) |
| Operating Temperature (commercial) | — | 0 °C to +85 °C |