EPM2210GF324C5 vs EPM2210GF324C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM2210GF324C5 sa pamamagitan ng Intel at EPM2210GF324C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPM2210GF324C5 - MAX II 2210 LE CPLD, 324-BGA, 5ns | Intel/Altera
EPM2210GF324C5 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EPM2210GF324C5 | EPM2210GF324C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Family | MAX II | MAX II |
| Device Name | EPM2210 | — |
| Logic Elements (LE) | 2,210 | — |
| Equivalent Macrocells | 1,700 | 1,700 |
| Maximum User I/Os | 272 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Pin-to-Pin Delay (tPD1) | 5 ns (C5 speed grade) | — |
| Internal Performance | 304 MHz | — |
| Core Voltage (VCCINT) | 1.8 V | — |
| I/O Voltage (VCCIO) - MultiVolt | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 6-layer-metal flash, 0.18 um | 0.18 µm 6-layer-metal flash |
| Temperature ng Junction na Operasyon | 0C to +85C (commercial) | — |
| Packhaging | 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm | 324-ball FineLine BGA (GF324) |
| In-System Programmability | JTAG (IEEE 1149.1) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Tindminan RoHS | Compliant (lead-free) | Compliant |
| Device Type | — | CPLD (Complex Programmable Logic Device) |
| Logic Elements | — | 2,210 |
| User I/Os (max) | — | 272 |
| Supply Voltage - Core (VCCINT) | — | 1.8 V |
| MultiVolt I/O Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Maximum Internal Frequency | — | 247.5 MHz |
| Pin-to-Pin Logic Delay (tPD) | — | 7.0 ns (C4 speed grade) |
| Programming Interface | — | IEEE 1149.1 JTAG (ISP) |
| Operating Temperature (commercial) | — | 0 °C to +85 °C |