K4A4G085WD-BCPB vs K4A4G085WD-BCTD Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4A4G085WD-BCPB disebabkan oleh Samsung Electronics dan K4A4G085WD-BCTD disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Samsung Electronics
K4A4G085WD-BCTD - 4Gb DDR4 SDRAM 512Mx8 2666Mbps | Samsung
K4A4G085WD-BCTD ✓ AktifPengandingan Spesifikasi
| Parametr | K4A4G085WD-BCPB | K4A4G085WD-BCTD |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gb | 4 Gb |
| Organisasi | 512M x 8 | 512M x 8 |
| Die Generation | D-die | D-die |
| Tegangan Pemberi Arus | 1.2 V | 1.2 V |
| Antaramuka | DDR4 (Double Data Rate 4) | DDR4 (JEDEC-compatible) |
| Kemasan | FBGA-78 (PB) | 78-ball FBGA |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Speed Grade / Data Rate | [DATA_NEEDED: speed grade / data rate] | — |
| Latensi CAS | [DATA_NEEDED: CAS latency] | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | 0C to +85C |
| Refresh | [DATA_NEEDED: refresh specification] | — |
| Status RoHS | Compliant (PB lead-free suffix) | [DATA_NEEDED: RoHS compliance status] |
| Boson Bebas | [DATA_NEEDED: halogen-free status] | — |
| Datasheet Pages | 66 pages (K4A4G085WD family datasheet) | — |
| Kadar Data | — | 2666 Mbps/pin |
| Ball Pitch | — | 0.8 mm |
| Speed Class | — | DDR4-2666 (PC4-21300) |
| Bank Architecture | — | DDR4 bank-group architecture |
| On-Die Termination (ODT) | — | Yes |
| DLL | — | Yes |
| Aras MSL | — | [DATA_NEEDED: moisture sensitivity level] |