K4A4G085WD-BCPB vs K4A4G085WD-BCTD Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng K4A4G085WD-BCPB sa pamamagitan ng Samsung Electronics at K4A4G085WD-BCTD sa pamamagitan ng Samsung Electronics. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Samsung Electronics
K4A4G085WD-BCTD - 4Gb DDR4 SDRAM 512Mx8 2666Mbps | Samsung
K4A4G085WD-BCTD ✓ NakahandaPagsanggunian na paghahambing
| Parametro | K4A4G085WD-BCPB | K4A4G085WD-BCTD |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gb | 4 Gb |
| Organisasyon | 512M x 8 | 512M x 8 |
| Die Generation | D-die | D-die |
| Volte ng Pagbibigay | 1.2 V | 1.2 V |
| Interface | DDR4 (Double Data Rate 4) | DDR4 (JEDEC-compatible) |
| Packhaging | FBGA-78 (PB) | 78-ball FBGA |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Speed Grade / Data Rate | [DATA_NEEDED: speed grade / data rate] | — |
| Latensya ng CAS | [DATA_NEEDED: CAS latency] | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | 0C to +85C |
| Refresh | [DATA_NEEDED: refresh specification] | — |
| Tindminan RoHS | Compliant (PB lead-free suffix) | [DATA_NEEDED: RoHS compliance status] |
| Wala sa Halogen | [DATA_NEEDED: halogen-free status] | — |
| Datasheet Pages | 66 pages (K4A4G085WD family datasheet) | — |
| Rate ng Data | — | 2666 Mbps/pin |
| Ball Pitch | — | 0.8 mm |
| Speed Class | — | DDR4-2666 (PC4-21300) |
| Bank Architecture | — | DDR4 bank-group architecture |
| On-Die Termination (ODT) | — | Yes |
| DLL | — | Yes |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |