K4A4G085WD-BCRC vs K4A4G085WD-BCPB Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4A4G085WD-BCRC disebabkan oleh Samsung Electronics dan K4A4G085WD-BCPB disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | K4A4G085WD-BCRC | K4A4G085WD-BCPB |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Memory Density | 4 Gbit | — |
| Organisasi | 512M x 8 | 512M x 8 |
| Jenis Ingatan | DDR4 SDRAM (D-die) | DDR4 SDRAM |
| Kadar Data | 2400 Mb/s (PC2400) | — |
| Tegangan Pemberi Arus | 1.2 V | 1.2 V |
| Kemasan | FBGA-78 (TFBGA) | FBGA-78 (PB) |
| Number of Terminals | 78 | — |
| Antaramuka | Parallel | DDR4 (Double Data Rate 4) |
| Access Mode | Multi-bank page burst | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Latensi CAS | [DATA_NEEDED: CAS Latency] | [DATA_NEEDED: CAS latency] |
| Gambaran Suhu Operasi | [DATA_NEEDED: Operating Temperature Range] | — |
| Refresh | [DATA_NEEDED: Refresh specification] | [DATA_NEEDED: refresh specification] |
| Status RoHS | [DATA_NEEDED: RoHS Status] | Compliant (PB lead-free suffix) |
| Aras MSL | [DATA_NEEDED: MSL Level] | — |
| Density | — | 4 Gb |
| Die Generation | — | D-die |
| Speed Grade / Data Rate | — | [DATA_NEEDED: speed grade / data rate] |
| Suhu Operasi | — | [DATA_NEEDED: operating temperature range] |
| Boson Bebas | — | [DATA_NEEDED: halogen-free status] |
| Datasheet Pages | — | 66 pages (K4A4G085WD family datasheet) |