K4A8G085WB vs K4A8G085WB-BCPB Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4A8G085WB disebabkan oleh Samsung Electronics dan K4A8G085WB-BCPB disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | K4A8G085WB | K4A8G085WB-BCPB |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Harga Unit (USD) | — | $4.10 |
| Jenis Ingatan | DDR4 SDRAM (B-die) | DDR4 SDRAM (volatile DRAM) |
| Density | 8 Gbit | — |
| Organisasi | 1G x 8 | — |
| Tegangan Pemberi Arus | 1.2 V | 1.2 V |
| Kemasan | 78-pin FBGA | 78-ball FBGA (BGA78 / TFBGA), rectangular, 11 mm length |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Operating Mode | DLL Enabled mode (per datasheet) | — |
| Speed Grade Suffixes | -BCRC, -BIRC, -BCTD, -BCPB (per family naming) | — |
| Kadar Data | [DATA_NEEDED: speed grade data rate in Mbps] | — |
| tCL/cas latency | [DATA_NEEDED: CAS latency] | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | 0C to +85C |
| Refresh | [DATA_NEEDED: refresh rate 1x/2x] | — |
| Bank Groups | [DATA_NEEDED: bank/bank group count] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Termination Voltage (VTT) | [DATA_NEEDED: VTT value] | — |
| Saiz Ingatan | — | 8 Gb |
| Memory Organization | — | 1G x 8 |
| Max Clock Frequency | — | 1066 MHz |
| Max Access Time | — | 0.18 ns |
| Max Standby Current | — | 0.016 mA |
| Refresh Cycles | — | 8192 |
| Technology | — | CMOS, 8Gb B-die |
| Number of Terminals | — | 78 |
| Antaramuka | — | DDR4 SDRAM parallel interface |
| Operating Temperature Grade | — | Commercial (0C to 85C) |