K4AAG165WA-BCPB vs K4A8G165WB-BCPB Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4AAG165WA-BCPB disebabkan oleh Samsung Electronics dan K4A8G165WB-BCPB disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Samsung Electronics
K4AAG165WA-BCPB - 16Gb DDR4 SDRAM 3200Mbps 1.2V | Samsung
K4AAG165WA-BCPB ✓ Aktif
Pengandingan Spesifikasi
| Parametr | K4AAG165WA-BCPB | K4A8G165WB-BCPB |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | Volatile DRAM (DDR4 SDRAM) | DDR4 SDRAM |
| Technology | DDR4 | — |
| Density | 16 Gb | 8 Gb |
| Organisasi | 1G x 16 | 512M x 16 |
| Kadar Data | 3200 Mbps | 2133 Mbps |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| Interface Voltage (VDDQ) | 1.2 V | — |
| Kemasan | FBGA-96 | 96FBGA (TFBGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | [DATA_NEEDED: operating temperature for BCPB grade] | 0C to +85C |
| Memory Format | DRAM | — |
| Packaging | Tray | — |
| Product Status | Active | — |
| Power Consumption | 25% lower than DDR3 (per Samsung DDR4 family) | — |
| Bank Group Architecture | Yes (DDR4 internal bank groups) | — |
| On-Die Termination (ODT) | Yes | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (per Lisleapex listing) |
| Max Capacity Family | Up to 32GB component (Samsung DDR4 family) | — |
| I/O Voltage (VDDQ) | — | 1.2 V |
| Number of Terminals | — | 96 |
| Package Shape | — | Rectangular, bottom terminal position |
| Die Generation | — | 8Gb B-die |
| Antaramuka | — | DDR4 (synchronous, double data rate) |
| Bank Groups | — | DDR4 bank-group architecture |
| Refresh | — | [DATA_NEEDED: refresh specification] |