K4RAH165VB-BIQK vs K4RAH086VB-BIQK Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4RAH165VB-BIQK disebabkan oleh Samsung Electronics dan K4RAH086VB-BIQK disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | K4RAH165VB-BIQK | K4RAH086VB-BIQK |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR5 SDRAM | DDR5 SDRAM |
| Density | 16 Gb | 16 Gb |
| Organisasi | 1G x 16 | 2G x 8 |
| Kadar Data | 4800 Mbps (MT/s) | 4800 Mbps/pin |
| Supply Voltage (VDD) | 1.1 V | — |
| On-Die ECC | Yes | — |
| Auto Self-Refresh | Yes | — |
| Asynchronous Reset | Yes | — |
| Write Leveling | Yes | — |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | — |
| DLL Enabled Mode | Yes (spec mode per datasheet) | — |
| Kemasan | [DATA_NEEDED: exact package ball count / FBGA designation] | 82FBGA |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Merek | Samsung Semiconductor | — |
| Core Supply Voltage | — | 1.1 V (nominal) |
| Configuration | — | X8 |
| Speed Grade | — | BIQK (-BIQK bin) |
| ECC | — | On-die ECC (DDR5 standard) |
| Antaramuka | — | DDR5 (CA reduced pin count) |
| Burst Length | — | 16 / 32 |
| Operating Mode | — | DLL enabled |
| Status RoHS | — | Compliant (Lead-Free & Halogen-Free per Samsung 82FBGA) |
| Latensi CAS | — | [DATA_NEEDED: CAS latency (CL)] |
| Refresh | — | [DATA_NEEDED: refresh rate specification] |
| Aras MSL | — | [DATA_NEEDED: moisture sensitivity level] |