LSM6DSO32XTR vs LSM6DSRTR Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci LSM6DSO32XTR disebabkan oleh STMicroelectronics dan LSM6DSRTR disebabkan oleh STMicroelectronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

STMicroelectronics
LSM6DSO32XTR LSM6DSO32XTR - 32g 6-Axis IMU with ML Core | ST

LSM6DSO32XTR - 32g 6-Axis IMU with ML Core | ST

LSM6DSO32XTR ✓ Aktif
STMicroelectronics
LSM6DSRTR LSM6DSRTR - 6-Axis IMU w/ 4000dps Gyro | STMicroelectronics

LSM6DSRTR - 6-Axis IMU w/ 4000dps Gyro | STMicroelectronics

LSM6DSRTR ✓ Aktif

Pengandingan Spesifikasi

Parametr LSM6DSO32XTR LSM6DSRTR
Merek STMicroelectronics STMicroelectronics
Kategori Motion Sensors Motion Sensors
Status Lingkungan Hidup Aktif Aktif
Jenis Sensus 6-axis IMU (3-axis accelerometer + 3-axis gyroscope) Accelerometer, Gyroscope, Temperature (6-axis IMU)
Accelerometer Full Scale +/-2 g to +/-32 g (user selectable) —
Gyroscope Full Scale +/-125 dps to +/-4000 dps —
Output Data Rate Up to 6.66 kHz (accelerometer and gyroscope) —
High-Performance Mode Current 0.55 mA (typical) —
Tegangan Pemberi Arus 1.71 V to 3.6 V 1.71 V to 3.6 V
Antaramuka I2C / SPI (3-wire and 4-wire) —
Embedded Features Finite State Machine (FSM), Machine Learning Core (MLC), Sensor Fusion Low Power (SFLP) —
Temperature Sensor Yes, on-chip —
FIFO Yes, smart FIFO with configurable watermark Up to 4 kB (configurable)
Interrupts 2 programmable hardware interrupt pins (INT1, INT2) —
Kemasan LGA-14, 2.5 x 3.0 x 0.83 mm LGA-14 (2.5 x 3.0 mm)
Suhu Operasi -40 C to +85 C -40 C to +85 C
Jenis Pemasangan Surface Mount Surface Mount
Status RoHS Compliant Compliant
Output Interface — I2C, SPI, I3C
Accelerometer Full-Scale Range — ±2/±4/±8/±16 g
Gyroscope Full-Scale Range — ±125/±250/±500/±1000/±2000/±4000 dps
Accelerometer Noise Density — [DATA_NEEDED: accel noise density]
Gyroscope Noise Density — [DATA_NEEDED: gyro noise density]
Aras MSL — [DATA_NEEDED: MSL level]
On-chip Processing — MLC (Machine Learning Core), FSM, sensor hub
Shipping Packaging — Tape & Reel (TR suffix)

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