M1AFS1500-1FGG256I vs M1AFS1500-1FGG256 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M1AFS1500-1FGG256I disebabkan oleh Microchip Technology dan M1AFS1500-1FGG256 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
M1AFS1500-1FGG256I - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS1500-1FGG256I ✓ AktifMicrochip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ AktifPengandingan Spesifikasi
| Parametr | M1AFS1500-1FGG256I | M1AFS1500-1FGG256 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Fusion (M1 series, mixed-signal FPGA) | — |
| System Gates | 1.5 million | 1,500,000 |
| Processor Core | ARM Cortex-M1 (soft core in fabric) | — |
| User I/O | 119 | — |
| Flash Configuration Memory | 276480 bits | — |
| Logic Cells | 38400 | 38,400 |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm flash-based | — |
| Kemasan | 256-LBGA (FBGA), 17x17 mm, 1.0 mm ball pitch | — |
| Suhu Operasi | -40C to +85C (industrial, I suffix) | — |
| Speed Grade | -1 (standard) | -1 |
| Configuration Type | Flash-based, instant-on, single chip | — |
| Security | 128-bit flash lock, AES decryption | — |
| Analog Features | Configurable analog blocks (mixed-signal) | — |
| Clock Management | Integrated CCC (clock conditioning circuits) | Integrated clock generation and management circuitry |
| Jenis Pemasangan | Surface Mount | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Series | — | Fusion (M1AFS1500) |
| Embedded Processor | — | ARM Cortex-M1 |
| Frekuensi Klock Maksimum | — | 350 MHz |
| Number of I/Os | — | 119 |
| Tegangan Pemberi Arus | — | 1.5 V |
| Technology | — | CMOS, 130 nm |
| Configuration Memory | — | Flash-based (non-volatile) |
| Kemasan / Case | — | 256-LBGA (FBGA, S-PBGA-B256) |
| Ball Pitch | — | 1.00 mm |
| Gaya Pemasangan | — | SMD/SMT |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +70 C |
| Packaging | — | Tray |
| Integrated Analog Blocks | — | Yes (configurable analog conditioning and conversion) |
| Integrated Flash Memory Blocks | — | Yes |