M29W800FB70N3F vs M29W800FT70ZA3SE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M29W800FB70N3F disebabkan oleh Micron Technology dan M29W800FT70ZA3SE disebabkan oleh Micron Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Micron Technology
M29W800FB70N3F - 8Mb Parallel NOR Flash 70ns TSOP-48 | Micron
M29W800FB70N3F ✓ AktifMicron Technology
M29W800FT70ZA3SE - 8Mbit 70ns NOR Flash | Micron | Embedded
M29W800FT70ZA3SE ✓ AktifPengandingan Spesifikasi
| Parametr | M29W800FB70N3F | M29W800FT70ZA3SE |
|---|---|---|
| Merek | Micron Technology | Micron Technology |
| Kategori | Memory ICs | EEPROM |
| Status Lingkungan Hidup | Aktif | Aktif |
| Density | 8 Mbit | 8 Mb |
| Organisasi | 512K x 16 / 1M x 8 | 512K x 16 |
| Access Time | 70 ns | 70 ns |
| Supply Voltage (VCC) | 2.7 V to 3.6 V | — |
| Jenis Antaramuka | Parallel | — |
| Jenis Ingatan | NOR Flash (Boot Block) | NOR Flash (Parallel) |
| Boot Block Location | Bottom | — |
| Block Count | 19 memory blocks (1 boot, 3 parameter, 15 main) | — |
| Bus Width Selection | x8 / x16 via BYTE# pin | — |
| Programming Time | 10 us per byte/word (typical) | — |
| CFI Compliant | Yes | — |
| Erase Suspend/Resume | Yes | — |
| Kemasan | TSOP-48 (12 x 20 mm) | 48-TFBGA (6x8 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | [DATA_NEEDED: Operating Temperature Range] | -40C to +125C |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Packaging | Tape & Reel | — |
| Saiz Ingatan | — | 8 Mbit |
| Technology | — | SLC |
| Antaramuka | — | Parallel |
| Tegangan Pemberi Arus | — | 2.7 V to 3.6 V |
| Programming Interface | — | CFI command set |
| Boot Block Architecture | — | Top boot (FT = top boot block) |
| FBGA Code | — | [DATA_NEEDED: FBGA code] |
| Chipset Validation | — | N/A |
| Program/Erase Cycles | — | [DATA_NEEDED: endurance] |