MC9S08LH36CLK vs G9S12GN32F1VLCR Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08LH36CLK disebabkan oleh NXP Semiconductors dan G9S12GN32F1VLCR disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
G9S12GN32F1VLCR - 16-bit S12G MCU, 32KB Flash, CAN/LIN | NXP
G9S12GN32F1VLCR ✓ AktifPengandingan Spesifikasi
| Parametr | MC9S08LH36CLK | G9S12GN32F1VLCR |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Frequency | 40 MHz | — |
| Bus Frequency (per distributor listing) | 16 MHz | — |
| Flash Memory | 36 KB (36K x 8) | — |
| Supply Voltage Range | 2.1 V to 3.6 V | — |
| Number of I/O | 37 | — |
| Kemasan | 80-LQFP (14 x 14 mm) | LQFP-32 |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Program Memory Type | FLASH | — |
| Operating Voltage at Reduced Speed | 2.1 V (up to 20 MHz, per family datasheet) | — |
| Lifecycle Stage | ACTIVE (per parametric source) | — |
| Status RoHS | RoHS Compliant | Compliant |
| Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| Peripherals | [DATA_NEEDED: peripheral set detail] | — |
| Package Body Dimensions | 14 mm x 14 mm | — |
| Core | — | S12 (HCS12, 16-bit CISC) |
| Program Flash | — | 32 KB |
| SRAM | — | 2 KB |
| Bus Frequency (max) | — | 25 MHz |
| CAN Controller | — | 1 x CAN 2.0A/B |
| LIN / SAE J2602 | — | Yes (via SCI + external transceiver) |
| ADC | — | 10-bit, 8 channels [DATA_NEEDED: channel count confirmation] |
| PWM Channels | — | Multi-channel 16-bit [DATA_NEEDED: exact channel count] |
| Enhanced Capture Timer (ECT) | — | Yes |
| Suhu Operasi | — | -40 C to +105 C (VLC suffix, automotive grade) [DATA_NEEDED: confirmation of grade letter] |
| Tingkat sensitiviti Air Nama (MSL) | — | 3 |
| Peak Reflow Temperature | — | 260 °C |
| Maximum Time at Peak Reflow | — | 40 s |
| Terminal Finish | — | Tin (Sn), matte |
| JEDEC J-STD-609 Code | — | e3 |
| Lead-Free | — | Yes (e3 Sn finish) |
| Security | — | Flash security lockout supported [DATA_NEEDED: full feature list] |
| Debug Interface | — | BDM (Background Debug Mode) |