MC9S08SH8MTG vs MC9S08QE8CWL Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08SH8MTG disebabkan oleh NXP Semiconductors dan MC9S08QE8CWL disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr MC9S08SH8MTG MC9S08QE8CWL
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND NRND
Core Processor HCS08 (S08 core, 8-bit CISC) HCS08 (S08)
Core Size 8-bit 8-bit
Maximum CPU Frequency 40 MHz 20 MHz at 1.8 V; 50.33 MHz bus at 2.1 V
Program Memory (Flash) 8 KB (8K x 8) 8 KB (8K x 8)
RAM Size 512 x 8 (512 B) —
EEPROM Size Not present (Flash-only) —
Operating Voltage Range 2.7 V to 5.5 V —
Number of I/O Pins 13 —
Kemasan 16-pin TSSOP (Tape and Reel) 28-pin SOIC W (7 mm x 7 mm, 1.40 mm height, 0.80 mm pitch)
Jenis Pemasangan Surface Mount Surface Mount
Connectivity I2C, LINbus, SCI, SPI I2C, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT, ACMP LVD, PWM, 16-bit Timer (TPM), BDM
ADC 12-channel, 10-bit, 2.5 µs conversion —
Temperature Sensor Internal (ADC channel) —
Interrupt Sources Up to 32 —
Debug Interface BDM (Background Debug Mode) Single-wire Background Debug Mode (BDM)
Lead-Free / RoHS Yes (per Mouser listing) —
Suhu Operasi [DATA_NEEDED: operating temperature range] -40 C to +85 C
Core Architecture — CISC, Harvard, 3-stage pipeline
RAM — 512 B
Supply Voltage (VDD) — 1.8 V to 3.6 V
I/O Pins — 28
PWM Channels — Up to 6
ROM Type — Flash
Status RoHS — Compliant (per NXP product page)
Series — S08QE Flexis
Gaya Pemasangan — Surface Mount
Family — MC9S08

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