MC9S12DJ128MPVE vs MC9S12DB128MPVE Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12DJ128MPVE disebabkan oleh NXP Semiconductors dan MC9S12DB128MPVE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S12DJ128MPVE MC9S12DJ128MPVE - 16-bit HCS12 MCU, 128KB Flash | NXP

MC9S12DJ128MPVE - 16-bit HCS12 MCU, 128KB Flash | NXP

MC9S12DJ128MPVE Nrnd
NXP Semiconductors
MC9S12DB128MPVE MC9S12DB128MPVE - 16-Bit HCS12 MCU, 128KB Flash, 25MHz | NXP

MC9S12DB128MPVE - 16-Bit HCS12 MCU, 128KB Flash, 25MHz | NXP

MC9S12DB128MPVE ✓ Aktif

Pengandingan Spesifikasi

Parametr MC9S12DJ128MPVE MC9S12DB128MPVE
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND Aktif
Core Architecture HCS12 (16-bit CISC) HCS12 (CPU12), 16-bit
Program Memory (Flash) 128 KB (128K x 8) —
RAM 8 KB —
EEPROM 2 KB —
Maximum CPU Clock 25 MHz (50 MHz internal bus via PLL, see datasheet) 25 MHz
Tegangan Pemberi Arus 2.35 V to 2.75 V (single 2.5V nominal) —
Digital I/O Pins 59 —
ADC 2x 8-channel, 10-bit —
PWM Channels 8 —
SCI (UART) 2 —
SPI 1 —
I2C (Inter-IC Bus) 1 —
Kemasan 112-LQFP (20x20 mm) —
Suhu Operasi -40C to +125C (automotive grade) —
Jenis Pemasangan Surface Mount Surface Mount (Gull Wing)
Aras MSL [DATA_NEEDED: MSL level per JEDEC J-STD-020] —
Debug Interface BDM (Background Debug Mode) —
Status RoHS Compliant Compliant
Program Memory (FLASH) — 128 KB (128K x 8)
Data Memory (RAM) — 8 KB (8K x 8)
Number of I/O Pins — 91
Oscillator Type — Internal
Kemasan / Case — 112-LQFP (20x20 mm)
Terminal Form — GULL WING
Number of Terminals — 112
Package Code — LQFP
Package Shape — SQUARE
Temperature Grade — AUTOMOTIVE
Packaging — Tray

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