MC9S12DP512MPVE vs MC9S12DG256CCPV Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12DP512MPVE disebabkan oleh NXP Semiconductors dan MC9S12DG256CCPV disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV NrndPengandingan Spesifikasi
| Parametr | MC9S12DP512MPVE | MC9S12DG256CCPV |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core Processor | HCS12 (CPU12), 16-bit CISC | — |
| Core Size | 16-bit | — |
| Frekuensi Klock Maksimum | 25 MHz | — |
| Program Memory Size | 512 KB (512K x 8) Flash | — |
| RAM Size | 12 KB | 12 KB |
| EEPROM Size | 4 KB | 4 KB |
| Number of I/O | 91 general-purpose I/O | — |
| ADC Resolution | 10-bit | — |
| Number of ADC Channels | 16 (two 8-channel 10-bit ADCs) | — |
| Serial Interfaces | 2x SCI (asynchronous serial), IIC, SPI | — |
| Timers | 8-channel enhanced capture timer (IC/OC) | Enhanced Capture Timer (ECT) + watchdog |
| PWM Channels | 8-channel pulse-width modulator | 8 channels |
| Kemasan | 112-LQFP (20x20 mm) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Program Memory Type | FLASH (0.25 um) | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | — |
| Tegangan Pemberi Arus | [DATA_NEEDED: supply voltage range] | — |
| Status Lingkungan Hidup | Active | — |
| Core | — | HCS12 (16-bit CISC) |
| Maximum CPU/Bus Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB (256K x 8) |
| Number of I/O Lines | — | 91 |
| Supply Voltage Range | — | 2.97 V to 5.5 V (single 5 V supply) |
| Gambaran Suhu Operasi | — | -40 °C to +85 °C (industrial) |
| Kemasan / Case | — | 112-LQFP (20 x 20 mm) |
| ADC | — | 8-channel, 10-bit |
| Communication Interfaces | — | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| On-chip Debug | — | Background Debug Mode (BDM) |
| Status RoHS | — | Compliant |
| Aras MSL | — | 3 (168 hours, JEDEC J-STD-020) |