MMA2301EGR2 vs MMA2301EG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MMA2301EGR2 disebabkan oleh NXP Semiconductors dan MMA2301EG disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MMA2301EGR2 - ±200g X-Axis MEMS Accelerometer | NXP | Industrial
MMA2301EGR2 ✓ AktifPengandingan Spesifikasi
| Parametr | MMA2301EGR2 | MMA2301EG |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Motion Sensors | Motion Sensors |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Jenis Sensus | Accelerometer, single-axis (X) | Accelerometer, single-axis (X) |
| Axis | X | X (single axis) |
| Acceleration Range (nominal) | +/-200 g | — |
| Acceleration Range (tested) | +/-225 g | — |
| Tegangan Pemberi Arus | 5 V | 5.0 V typical (ratiometric output) |
| Sensitivity | 9.5 mV/g to 10.5 mV/g | [DATA_NEEDED: sensitivity mV/g] |
| Jenis Output | Analog, ratiometric | Analog, ratiometric voltage |
| Bandwidth | 400 Hz (4-pole low-pass) | 400 Hz (4-pole low-pass filter, factory trimmed) |
| Suhu Operasi | -40C to +125C | −40 °C to +125 °C (automotive) |
| Kemasan | 16-pin SOIC, case 475-01 (Tape & Reel) | 16-SOIC (SOP-16 wide-body, 7.5 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Sensing Technology | Silicon capacitive micromachined (MEMS) | — |
| Filter | 4-pole low-pass (factory set) | — |
| Temperature Compensation | On-chip active compensation | — |
| Lead Free Status | Lead Free Compliant by Exemption | Lead Free – Compliant by Exemption |
| Status RoHS | RoHS Compliant | RoHS Compliant |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | MMA | — |
| Gambaran UKUR | — | ±225 g (full scale); 200 g nominal |
| Zero-g Output | — | [DATA_NEEDED: zero-g output voltage] |
| Filter Type | — | 4-pole low-pass (Bessel-type), internal |
| Technology | — | MEMS, silicon capacitive surface micromachined |
| Signal Conditioning | — | Integrated ASIC; on-chip temperature compensation |
| External Components Required | — | None (zero-g, full-scale, and filter factory calibrated) |