MMA2301EGR2 vs MMA2301EG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MMA2301EGR2 sa pamamagitan ng NXP Semiconductors at MMA2301EG sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MMA2301EGR2 - ±200g X-Axis MEMS Accelerometer | NXP | Industrial
MMA2301EGR2 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MMA2301EGR2 | MMA2301EG |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Motion Sensors | Motion Sensors |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Type ng Sensor | Accelerometer, single-axis (X) | Accelerometer, single-axis (X) |
| Axis | X | X (single axis) |
| Acceleration Range (nominal) | +/-200 g | — |
| Acceleration Range (tested) | +/-225 g | — |
| Volte ng Pagbibigay | 5 V | 5.0 V typical (ratiometric output) |
| Sensitivity | 9.5 mV/g to 10.5 mV/g | [DATA_NEEDED: sensitivity mV/g] |
| Type ng Output | Analog, ratiometric | Analog, ratiometric voltage |
| Bandwidth | 400 Hz (4-pole low-pass) | 400 Hz (4-pole low-pass filter, factory trimmed) |
| Temperature na Operasyon | -40C to +125C | −40 °C to +125 °C (automotive) |
| Packhaging | 16-pin SOIC, case 475-01 (Tape & Reel) | 16-SOIC (SOP-16 wide-body, 7.5 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Sensing Technology | Silicon capacitive micromachined (MEMS) | — |
| Filter | 4-pole low-pass (factory set) | — |
| Temperature Compensation | On-chip active compensation | — |
| Lead Free Status | Lead Free Compliant by Exemption | Lead Free – Compliant by Exemption |
| Tindminan RoHS | RoHS Compliant | RoHS Compliant |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | MMA | — |
| Hanay ng Pagtutukoy | — | ±225 g (full scale); 200 g nominal |
| Zero-g Output | — | [DATA_NEEDED: zero-g output voltage] |
| Filter Type | — | 4-pole low-pass (Bessel-type), internal |
| Technology | — | MEMS, silicon capacitive surface micromachined |
| Signal Conditioning | — | Integrated ASIC; on-chip temperature compensation |
| External Components Required | — | None (zero-g, full-scale, and filter factory calibrated) |