MMA6262QR2 vs MMA6262QR2-FR Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MMA6262QR2 disebabkan oleh NXP Semiconductors dan MMA6262QR2-FR disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MMA6262QR2 - ±1.5g X/Y Dual-Axis Accelerometer | NXP
MMA6262QR2 ⚠ Bahagian terakhir untuk beliNXP Semiconductors
MMA6262QR2-FR - ±1.5g Dual-Axis Micromachined Accelerometer | NXP
MMA6262QR2-FR NrndPengandingan Spesifikasi
| Parametr | MMA6262QR2 | MMA6262QR2-FR |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Motion Sensors | Motion Sensors |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Jenis Sensus | Accelerometer, Dual-Axis (X, Y) | Accelerometer, dual-axis (X, Y) |
| Acceleration Range | ±1.5 g | ±1.5 g |
| Sensitivity | 740 mV/g to 860 mV/g (at 3.3 V) | 800 mV/g (typical, ratiometric) |
| Supply Voltage (VDD) | 3.15 V to 5.25 V (per MMA6801KW comp doc) | 2.2 V to 3.6 V |
| Jenis Output | Analog, Ratiometric | Analog, ratiometric to VDD |
| Bandwidth (Low-Pass Filter) | 150 Hz (1-pole factory-set) | — |
| Zero-g Offset | Factory calibrated, no external trim required | — |
| Temperature Compensation | On-chip, factory-set | — |
| Suhu Operasi | -40 °C to +105 °C [DATA_NEEDED: confirm upper limit from full NXP datasheet] | -40 °C to +105 °C |
| Kemasan / Case | 16-QFN-EP (6x6 mm) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Supplier Device Package | 16-QFN-EP (6x6) | — |
| Lead Free Status | Contains Lead (per digchip snippet) | — |
| Status RoHS | RoHS3 Compliant | RoHS Compliant (Contains Lead in some variants - check datasheet) |
| Sense Technology | Capacitive Micromachined (MEMS) | — |
| Number of Axes | — | 2 (X, Y) |
| Bandwidth (-3 dB) | — | 150 Hz (internal 1-pole LPF) |
| Arus Pemberi Arus | — | 2 mA (typical) |
| Zero-g Output (ratiometric) | — | VDD/2 (typical) |
| Shock Survival | — | 2000 g |
| Self-Test | — | Yes (external logic input) |
| Kemasan | — | 16-QFN-EP, 6 mm x 6 mm, exposed thermal pad |
| MEMS Process | — | Capacitive micromachined (surface micromachining) |