MMA6262QR2 vs MMA6262QR2-FR Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MMA6262QR2 sa pamamagitan ng NXP Semiconductors at MMA6262QR2-FR sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MMA6262QR2-FR - ±1.5g Dual-Axis Micromachined Accelerometer | NXP
MMA6262QR2-FR NrndPagsanggunian na paghahambing
| Parametro | MMA6262QR2 | MMA6262QR2-FR |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Motion Sensors | Motion Sensors |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Type ng Sensor | Accelerometer, Dual-Axis (X, Y) | Accelerometer, dual-axis (X, Y) |
| Acceleration Range | ±1.5 g | ±1.5 g |
| Sensitivity | 740 mV/g to 860 mV/g (at 3.3 V) | 800 mV/g (typical, ratiometric) |
| Supply Voltage (VDD) | 3.15 V to 5.25 V (per MMA6801KW comp doc) | 2.2 V to 3.6 V |
| Type ng Output | Analog, Ratiometric | Analog, ratiometric to VDD |
| Bandwidth (Low-Pass Filter) | 150 Hz (1-pole factory-set) | — |
| Zero-g Offset | Factory calibrated, no external trim required | — |
| Temperature Compensation | On-chip, factory-set | — |
| Temperature na Operasyon | -40 °C to +105 °C [DATA_NEEDED: confirm upper limit from full NXP datasheet] | -40 °C to +105 °C |
| Packhaging / Kaso | 16-QFN-EP (6x6 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Supplier Device Package | 16-QFN-EP (6x6) | — |
| Lead Free Status | Contains Lead (per digchip snippet) | — |
| Tindminan RoHS | RoHS3 Compliant | RoHS Compliant (Contains Lead in some variants - check datasheet) |
| Sense Technology | Capacitive Micromachined (MEMS) | — |
| Number of Axes | — | 2 (X, Y) |
| Bandwidth (-3 dB) | — | 150 Hz (internal 1-pole LPF) |
| Kuru-kuryente ng Pagbibigay | — | 2 mA (typical) |
| Zero-g Output (ratiometric) | — | VDD/2 (typical) |
| Shock Survival | — | 2000 g |
| Self-Test | — | Yes (external logic input) |
| Packhaging | — | 16-QFN-EP, 6 mm x 6 mm, exposed thermal pad |
| MEMS Process | — | Capacitive micromachined (surface micromachining) |