MPX2010DP vs MPX2010GS Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPX2010DP disebabkan oleh NXP Semiconductors dan MPX2010GS disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPX2010DP | MPX2010GS |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Jenis Sensus | Differential Pressure Sensor | — |
| Pressure Range | 0 to 10 kPa (0 to 1.45 PSI) | — |
| Technology | Piezoresistive (silicon strain gauge bridge) | Piezoresistive (silicon diaphragm) |
| Jenis Output | Analog voltage, Wheatstone bridge (mV level) | Wheatstone Bridge (analog voltage) |
| Typical Full-Scale Span | 25 mV at 10 V excitation | — |
| Zero Pressure Offset | 0 mV nominally (±1.0 mV max) | — |
| Tegangan Pemberi Arus | 10 V DC typical (max 16 V) | 10 V to 16 V |
| Linearity | ±0.05% (typ) | — |
| Temperature Compensation | 0 °C to +85 °C (on-chip) | — |
| Suhu Operasi | -40 °C to +125 °C | -40C to +125C (per MPX2010 series datasheet) |
| Response Time | 1.0 ms (typical) | — |
| Maximum Overpressure | 75 kPa | — |
| Burst Pressure | 200 kPa | — |
| Port Configuration | Dual ports (differential), 0.19 inch / 4.93 mm tubes | — |
| Package / Mounting | 4-SIP Module (through-hole with axial tubes) | — |
| Media Compatibility | Dry air or non-corrosive gas | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status of this lot] |
| Pressure Type | — | Vented Gauge |
| Operating Pressure | — | 1.45 PSI (10 kPa) |
| Maximum Pressure | — | [DATA_NEEDED: maximum overpressure rating] |
| Tegangan Output | — | 0 mV to 25 mV at 10 V excitation |
| Accuracy | — | +/-1% (per data brief) |
| Port Size | — | Male - 0.19" (4.93 mm) Tube |
| Port Style | — | Barbed, single vented-gauge port |
| Kemasan / Case | — | 4-SIP Module |
| Jenis Pemasangan | — | Through-Hole |
| Compensation | — | On-chip temperature compensated and calibrated |