MPX2010DP vs MPX2010GS Karşılaştırma
Ayrıntılı yan yana karşılaştırma MPX2010DP tarafından NXP Semiconductors ve MPX2010GS tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | MPX2010DP | MPX2010GS |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Yaşam Döngüsü Durumu | Aktif | Obsolete |
| Duyarlılık Türü | Differential Pressure Sensor | — |
| Pressure Range | 0 to 10 kPa (0 to 1.45 PSI) | — |
| Technology | Piezoresistive (silicon strain gauge bridge) | Piezoresistive (silicon diaphragm) |
| Çıkış Türü | Analog voltage, Wheatstone bridge (mV level) | Wheatstone Bridge (analog voltage) |
| Typical Full-Scale Span | 25 mV at 10 V excitation | — |
| Zero Pressure Offset | 0 mV nominally (±1.0 mV max) | — |
| Besleme Gerilimi | 10 V DC typical (max 16 V) | 10 V to 16 V |
| Linearity | ±0.05% (typ) | — |
| Temperature Compensation | 0 °C to +85 °C (on-chip) | — |
| İşletim Sıcaklığı | -40 °C to +125 °C | -40C to +125C (per MPX2010 series datasheet) |
| Response Time | 1.0 ms (typical) | — |
| Maximum Overpressure | 75 kPa | — |
| Burst Pressure | 200 kPa | — |
| Port Configuration | Dual ports (differential), 0.19 inch / 4.93 mm tubes | — |
| Package / Mounting | 4-SIP Module (through-hole with axial tubes) | — |
| Media Compatibility | Dry air or non-corrosive gas | — |
| RoHS Durumu | Compliant | [DATA_NEEDED: RoHS status of this lot] |
| Pressure Type | — | Vented Gauge |
| Operating Pressure | — | 1.45 PSI (10 kPa) |
| Maximum Pressure | — | [DATA_NEEDED: maximum overpressure rating] |
| Çıkış Gerilimi | — | 0 mV to 25 mV at 10 V excitation |
| Accuracy | — | +/-1% (per data brief) |
| Port Size | — | Male - 0.19" (4.93 mm) Tube |
| Port Style | — | Barbed, single vented-gauge port |
| Paket / Kas | — | 4-SIP Module |
| Montaj Türü | — | Through-Hole |
| Compensation | — | On-chip temperature compensated and calibrated |