MPX2100DP vs MPX2010DP Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MPX2100DP disebabkan oleh NXP Semiconductors dan MPX2010DP disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MPX2100DP MPX2100DP - 100kPa Differential Pressure Sensor, 40mV | NXP

MPX2100DP - 100kPa Differential Pressure Sensor, 40mV | NXP

MPX2100DP ✓ Aktif
NXP Semiconductors
MPX2010DP MPX2010DP - 10 kPa Differential Pressure Sensor | NXP/STMicro

MPX2010DP - 10 kPa Differential Pressure Sensor | NXP/STMicro

MPX2010DP ✓ Aktif

Pengandingan Spesifikasi

Parametr MPX2100DP MPX2010DP
Merek NXP Semiconductors NXP Semiconductors
Kategori Pressure Sensors Pressure Sensors
Status Lingkungan Hidup Aktif Aktif
Pressure Type Differential —
Operating Pressure Range 0 kPa to 100 kPa (0 to 14.5 psi) —
Maximum Overload Pressure [DATA_NEEDED: maximum overload pressure] —
Full-Scale Span (Typical) 40 mV (at 10 V excitation) —
Zero Pressure Offset [DATA_NEEDED: zero pressure offset] 0 mV nominally (±1.0 mV max)
Linearity 1% typical ±0.05% (typ)
Tegangan Pemberi Arus 10 V DC typical 10 V DC typical (max 16 V)
Arus Pemberi Arus [DATA_NEEDED: supply current] —
Jenis Output Analog mV (Wheatstone Bridge) Analog voltage, Wheatstone bridge (mV level)
Suhu Operasi 0C to +85C (compensated) -40 °C to +125 °C
Storage Temperature [DATA_NEEDED: storage temperature] —
Port Configuration Dual port, axial tube, 4.93 mm (0.19 in) Dual ports (differential), 0.19 inch / 4.93 mm tubes
Kemasan / Case 4-SIP Module (Case 344C-01) —
Jenis Pemasangan Through-Hole —
Technology Silicon piezoresistive, on-chip temperature compensation Piezoresistive (silicon strain gauge bridge)
Status RoHS Compliant Compliant
Aras MSL [DATA_NEEDED: MSL rating] —
Jenis Sensus — Differential Pressure Sensor
Pressure Range — 0 to 10 kPa (0 to 1.45 PSI)
Typical Full-Scale Span — 25 mV at 10 V excitation
Temperature Compensation — 0 °C to +85 °C (on-chip)
Response Time — 1.0 ms (typical)
Maximum Overpressure — 75 kPa
Burst Pressure — 200 kPa
Package / Mounting — 4-SIP Module (through-hole with axial tubes)
Media Compatibility — Dry air or non-corrosive gas

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