MPX2100DP vs MPX2010DP Karşılaştırma

Ayrıntılı yan yana karşılaştırma MPX2100DP tarafından NXP Semiconductors ve MPX2010DP tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

NXP Semiconductors
MPX2100DP MPX2100DP - 100kPa Differential Pressure Sensor, 40mV | NXP

MPX2100DP - 100kPa Differential Pressure Sensor, 40mV | NXP

MPX2100DP ✓ Aktif
NXP Semiconductors
MPX2010DP MPX2010DP - 10 kPa Differential Pressure Sensor | NXP/STMicro

MPX2010DP - 10 kPa Differential Pressure Sensor | NXP/STMicro

MPX2010DP ✓ Aktif

Özellik Karşılaştırması

Parametre MPX2100DP MPX2010DP
Marka NXP Semiconductors NXP Semiconductors
Kategori Pressure Sensors Pressure Sensors
Yaşam Döngüsü Durumu Aktif Aktif
Pressure Type Differential —
Operating Pressure Range 0 kPa to 100 kPa (0 to 14.5 psi) —
Maximum Overload Pressure [DATA_NEEDED: maximum overload pressure] —
Full-Scale Span (Typical) 40 mV (at 10 V excitation) —
Zero Pressure Offset [DATA_NEEDED: zero pressure offset] 0 mV nominally (±1.0 mV max)
Linearity 1% typical ±0.05% (typ)
Besleme Gerilimi 10 V DC typical 10 V DC typical (max 16 V)
Besleme Akımı [DATA_NEEDED: supply current] —
Çıkış Türü Analog mV (Wheatstone Bridge) Analog voltage, Wheatstone bridge (mV level)
İşletim Sıcaklığı 0C to +85C (compensated) -40 °C to +125 °C
Storage Temperature [DATA_NEEDED: storage temperature] —
Port Configuration Dual port, axial tube, 4.93 mm (0.19 in) Dual ports (differential), 0.19 inch / 4.93 mm tubes
Paket / Kas 4-SIP Module (Case 344C-01) —
Montaj Türü Through-Hole —
Technology Silicon piezoresistive, on-chip temperature compensation Piezoresistive (silicon strain gauge bridge)
RoHS Durumu Compliant Compliant
MSL Seviyesi [DATA_NEEDED: MSL rating] —
Duyarlılık Türü — Differential Pressure Sensor
Pressure Range — 0 to 10 kPa (0 to 1.45 PSI)
Typical Full-Scale Span — 25 mV at 10 V excitation
Temperature Compensation — 0 °C to +85 °C (on-chip)
Response Time — 1.0 ms (typical)
Maximum Overpressure — 75 kPa
Burst Pressure — 200 kPa
Package / Mounting — 4-SIP Module (through-hole with axial tubes)
Media Compatibility — Dry air or non-corrosive gas

Dökümanlar & Kaynaklar

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