MPX5010GSX vs MPX5010DP Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPX5010GSX disebabkan oleh NXP Semiconductors dan MPX5010DP disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPX5010GSX | MPX5010DP |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Pressure Sensors | Pressure Sensors |
| Status Lingkungan Hidup | Aktif | Aktif |
| Pressure Type | Vented Gauge | Differential |
| Operating Pressure Range | 0 kPa to 10 kPa (0 to 1.45 PSI) | 0 kPa to 10 kPa (0 to 1.45 PSI) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | [DATA_NEEDED: max overload kPa] |
| Jenis Output | Analog Voltage | Analog, ratiometric |
| Output Voltage Span | 0.2 V to 4.7 V | — |
| Supply Voltage (VCC) | 4.5 V to 5.5 V | — |
| Arus Pemberi Arus | [DATA_NEEDED: supply current typical] | [DATA_NEEDED: supply current mA] |
| Accuracy | 1.0 % typical (per datasheet) | — |
| Response Time | [DATA_NEEDED: response time] | — |
| Suhu Operasi | 0 C to 85 C | 0 C to +85 C (compensated) |
| Port Size | Male 0.19 inch (4.93 mm) Tube, Side Port | — |
| Kemasan / Case | 6-SIP Module (Case 867F) | — |
| Termination Style | Through-Hole PCB | — |
| Jenis Pemasangan | Through Hole | Through-hole (SIP) |
| Status RoHS | Compliant | Compliant |
| Media Compatibility | Dry gases (air, non-corrosive) | — |
| Technology | Piezoresistive MEMS with on-chip ASIC | Piezoresistive, monolithic silicon, on-chip signal conditioned |
| Sensitivity | — | 450 mV/kPa (typical) |
| Gambaran Tegangan Output | — | 0.2 V to 4.7 V |
| Tegangan Pemberi Arus | — | 4.75 V to 5.25 V (5 V typical) |
| Linearity | — | ±1.5% VFSS (typical, 0-85 C) |
| Storage Temperature | — | [DATA_NEEDED: storage temperature C] |
| Port Configuration | — | Dual axial ports, 4.93 mm (0.19 in) tube |
| Kemasan | — | 6-SIP Module |