MSC8156ESAG1000B vs MSC8157ESVT1000A Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MSC8156ESAG1000B disebabkan oleh NXP Semiconductors dan MSC8157ESVT1000A disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors
MSC8156ESAG1000B ✗ Akhir HayatNXP Semiconductors
MSC8157ESVT1000A - 6-Core SC3850 DSP 1GHz FCBGA-783 | NXP
MSC8157ESVT1000A ObsoletePengandingan Spesifikasi
| Parametr | MSC8156ESAG1000B | MSC8157ESVT1000A |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | DSP | DSP |
| Status Lingkungan Hidup | Akhir Hidup | Obsolete |
| DSP Cores | 6x SC3850 StarCore cores | — |
| Core Clock Frequency | 1 GHz per core | — |
| Aggregate Performance | [DATA_NEEDED: aggregate MMACS rating] | — |
| Process Technology | 45 nm CMOS | CMOS |
| Hardware Accelerator | MAPLE-B baseband accelerator (turbo decode) | — |
| Memory Controller | 64-bit DDR2/DDR3, up to 800 MT/s | Multi-channel DDR SDRAM controller |
| SerDes Lanes | 2 lanes, SRIO or PCIe (selectable) | — |
| Ethernet | 1x Gigabit Ethernet MAC | — |
| Packet Engine | QUICC Engine subsystem | — |
| Security Engine | SEC 4.0 (Cryptographic accelerator) | — |
| Kemasan | 783-ball FCBGA (29x29 mm) | — |
| Suhu Operasi | 0C to +105C | 0C to +105C |
| Tegangan Pemberi Arus | [DATA_NEEDED: core and I/O rail voltages] | 1.0 V core (typical) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (FCBGA) |
| Status RoHS | [DATA_NEEDED: RoHS compliance] | — |
| Status Lingkungan Hidup | End of Life (per NXP PCN) | Obsolete (stock available from authorized distributors) |
| Product Type | — | Multi-core Digital Signal Processor (DSP) |
| DSP Core Architecture | — | StarCore SC3850 (Six cores) |
| Core Clock Speed | — | 1 GHz |
| Performance | — | 1000 MIPS per core / 6000 MIPS aggregate |
| Lebar Bus Data | — | 32-Bit / 64-Bit |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| Package Type | — | FCBGA-783 (Flip-Chip BGA, 29x29 mm) |
| Pin/Ball Count | — | 783 |
| Lead-Free / RoHS | — | Yes (lead-free) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |
| High-Speed Interfaces | — | Serial RapidIO, SGMII, PCI Express, Ethernet, I2C, SPI, UART |