MSC8156ESAG1000B vs MSC8157ESVT1000A 比較

詳細並排比較 MSC8156ESAG1000B 由 NXP Semiconductors 與 MSC8157ESVT1000A 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MSC8156ESAG1000B MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors

MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors

MSC8156ESAG1000B ✗ 停產
NXP Semiconductors
MSC8157ESVT1000A MSC8157ESVT1000A - 6-Core SC3850 DSP 1GHz FCBGA-783 | NXP

MSC8157ESVT1000A - 6-Core SC3850 DSP 1GHz FCBGA-783 | NXP

MSC8157ESVT1000A Obsolete

規格比較

參數 MSC8156ESAG1000B MSC8157ESVT1000A
品牌 NXP Semiconductors NXP Semiconductors
類別 DSP DSP
生命週期狀態 停產終止 Obsolete
DSP Cores 6x SC3850 StarCore cores —
Core Clock Frequency 1 GHz per core —
Aggregate Performance [DATA_NEEDED: aggregate MMACS rating] —
Process Technology 45 nm CMOS CMOS
Hardware Accelerator MAPLE-B baseband accelerator (turbo decode) —
Memory Controller 64-bit DDR2/DDR3, up to 800 MT/s Multi-channel DDR SDRAM controller
SerDes Lanes 2 lanes, SRIO or PCIe (selectable) —
Ethernet 1x Gigabit Ethernet MAC —
Packet Engine QUICC Engine subsystem —
Security Engine SEC 4.0 (Cryptographic accelerator) —
封裝 783-ball FCBGA (29x29 mm) —
工作溫度 0C to +105C 0C to +105C
供應電壓 [DATA_NEEDED: core and I/O rail voltages] 1.0 V core (typical)
安裝類型 Surface Mount (BGA) Surface Mount (FCBGA)
RoHS 狀態 [DATA_NEEDED: RoHS compliance] —
生命週期狀態 End of Life (per NXP PCN) Obsolete (stock available from authorized distributors)
Product Type — Multi-core Digital Signal Processor (DSP)
DSP Core Architecture — StarCore SC3850 (Six cores)
Core Clock Speed — 1 GHz
Performance — 1000 MIPS per core / 6000 MIPS aggregate
資料匯流排寬度 — 32-Bit / 64-Bit
L1 Instruction Cache (per core) — 32 KB
L1 Data Cache (per core) — 32 KB
Package Type — FCBGA-783 (Flip-Chip BGA, 29x29 mm)
Pin/Ball Count — 783
Lead-Free / RoHS — Yes (lead-free)
Moisture Sensitivity Level — [DATA_NEEDED: MSL rating]
High-Speed Interfaces — Serial RapidIO, SGMII, PCI Express, Ethernet, I2C, SPI, UART

資料表與資源

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