MT40A2G8AG-062E vs H5ANAG8NBJR-PBC Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MT40A2G8AG-062E disebabkan oleh Micron Technology dan H5ANAG8NBJR-PBC disebabkan oleh SK hynix. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Micron Technology
MT40A2G8AG-062E MT40A2G8AG-062E - 16Gb DDR4 SDRAM 2Gx8 3200Mbps | Micron

MT40A2G8AG-062E - 16Gb DDR4 SDRAM 2Gx8 3200Mbps | Micron

MT40A2G8AG-062E ✓ Aktif

Pengandingan Spesifikasi

Parametr MT40A2G8AG-062E H5ANAG8NBJR-PBC
Merek Micron Technology SK hynix
Kategori Memory ICs DRAM
Status Lingkungan Hidup Aktif Aktif
Jenis Ingatan DDR4 SDRAM DDR4 SDRAM
Density 16 Gbit 16 Gbit (2 GB)
Organisasi 2G x 8 x8
Speed DDR4-3200 (3200 MT/s) —
Clock Frequency 1600 MHz —
Access Time (Clock Cycle Time) 0.625 ns (tCK) —
Latensi CAS CL22 (DDR4-3200) —
Access Time 19 ns —
Supply Voltage VDD 1.2 V —
I/O Interface POD12 (1.2 V pseudo-open drain) —
VPP Voltage 2.5 V —
Number of Banks 16 (4 bank groups x 4 banks) —
Operating Temperature (AUT grade) -40C to +95C (per Micron grade table) —
Kemasan 78-FBGA (7.5 x 11 mm) FBGA-78 (7.5 mm x 11 mm)
Jenis Pemasangan Surface Mount Surface Mount
Status RoHS Compliant Compliant (Lead-Free & Halogen-Free per Hynix family datasheet)
Die Revision AG (current generation) BJR
Supply Voltage (VDD) — 1.2 V
Speed Grade / Data Rate — PBC suffix, DDR4-2666 class
Bank Architecture — 16 banks in 4 bank groups (DDR4 standard)
Prefetch — 8n
Jenis Antaramuka — Parallel, SSTL12
Suhu Operasi — [DATA_NEEDED: operating temperature range]
CAS Latency (typical bin) — [DATA_NEEDED: CAS latency]
Refresh — Self refresh, 1x/2x/4x refresh modes
Aras MSL — [DATA_NEEDED: moisture sensitivity level]
Standard Package Quantity — [DATA_NEEDED: standard quantity]

Laporan Datasheet & Sumber

Lihat Semua Produk Buat BOQ Minta Bao Harga