P1013NXN2LFB vs P1022NXN2LFB Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci P1013NXN2LFB disebabkan oleh NXP Semiconductors dan P1022NXN2LFB disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
P1013NXN2LFB P1013NXN2LFB - QorIQ P1022 Power Arch SoC 1GHz | NXP

P1013NXN2LFB - QorIQ P1022 Power Arch SoC 1GHz | NXP

P1013NXN2LFB ⚠ Bahagian terakhir untuk beli
NXP Semiconductors
P1022NXN2LFB P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr P1013NXN2LFB P1022NXN2LFB
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Masa Terakhir Dibeli Masa Terakhir Dibeli
Family QorIQ P1022 (P1 series) —
Core Architecture 32-bit Power Architecture e500v2 —
Number of Cores 1 —
Core Frequency 1.067 GHz —
L1 Cache (per core) 32 KB instruction + 32 KB data —
L2 Cache 256 KB platform cache —
Memory Controller DDR2/DDR3 with ECC, 64-bit data bus DDR2/DDR3 with ECC support, up to 32-bit
Ethernet MACs 3 x 10/100/1000 (2x SGMII/HS SerDes, 1x RGMII) 3 x 10/100/1000 Mbps Gigabit
PCI Express 2 x PCIe Gen 1.1 (x4 / x1) —
USB 1 x USB 2.0 with integrated PHY USB 2.0 host/device
Other Interfaces eSDHC, eSPI, I2C, UART, eLBC, LCD controller —
Kemasan 689-ball TEPBGA II (31 mm x 31 mm) —
Suhu Operasi -40C to +125C (junction) -40 °C to +125 °C (industrial)
Process 45 nm SOI —
Tegangan Pemberi Arus 1.5 V / 1.8 V / 2.5 V / 3.3 V 3.13 V to 3.47 V
Security SEC 4.0 (optional crypto accelerator) on die variant —
Jenis Pemasangan Surface Mount (BGA) Surface Mount (BGA, requires thermal via array under die)
Status RoHS Compliant (Pb-free ball finish) —
Architecture — Power Architecture e500 dual-core (RISC, 32-bit)
Clock Speed (Core) — 1.067 GHz
Platform Version — 1067/533/667 ET NE r1.1
Core Count — 2
Package Type — TEPBGA-689 (Plastic, halogen-free, RoHS-compliant)
Package Dimensions — 31 x 31 mm, 2.23 mm height
Kiraan Pin — 689
PCIe Interfaces — 3 x PCIe Gen1
Display Controller — 32-bit LCD controller
Security Engine — Integrated (symmetric/asymmetric crypto acceleration)
RoHS Compliance — Yes (halogen-free)

Laporan Datasheet & Sumber

Lihat Semua Produk Buat BOQ Minta Bao Harga