W25M02GWZEIG-TR vs W25M02GWZEIG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci W25M02GWZEIG-TR disebabkan oleh Winbond dan W25M02GWZEIG disebabkan oleh Winbond. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | W25M02GWZEIG-TR | W25M02GWZEIG |
|---|---|---|
| Merek | Winbond | Winbond |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | Non-Volatile NAND Flash (SLC) | Serial NAND Flash (SLC) |
| Density | 2 Gbit (256 MB) - 2 x 1 Gbit die stacked | 2 Gbit (2 x 1 Gbit stacked die) |
| Memory Interface | SPI - Single, Dual, Quad I/O | — |
| Supply Voltage (VCC) | 1.7 V to 1.95 V (1.8 V typ.) | — |
| Maximum SPI Clock | 104 MHz | — |
| Access Time | 8 ns | — |
| Page Size | 2048 bytes + 64 bytes spare area | 2048 bytes + 64 bytes spare |
| Block Size | 128 KB (64 pages) | 64 pages (131,072 bytes) |
| Program/Erase Endurance | 100,000 cycles per block | — |
| Data Retention | 10 years typical | 10 years typical |
| Kemasan | 8-WSON (ZE) 8x6 mm | WSON-8 (8x6 mm) with exposed pad |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | -40C to +85C (Industrial) | -40 C to +85 C (industrial) |
| Aras MSL | 3 (168 hours) | MSL3 (per JEDEC J-STD-020) |
| Packaging | Tape & Reel (TR) | — |
| Status RoHS | Compliant | Compliant (ROHS3) |
| Architecture | — | Multi-Chip Package (MCP), two W25N01GW die |
| Supply Voltage VCC | — | 1.7 V to 1.95 V (1.8 V typ) |
| Antaramuka | — | Standard SPI, Dual SPI, Quad SPI |
| Frekuensi Klock Maksimum | — | 104 MHz |
| Endurance | — | 100,000 program/erase cycles per block |
| Internal ECC | — | Configurable, up to 8-bit per 512-byte sector |
| Boson Bebas | — | Yes |