W25M02GWZEIG vs W25M02GWZEIG-TR Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci W25M02GWZEIG disebabkan oleh Winbond dan W25M02GWZEIG-TR disebabkan oleh Winbond. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | W25M02GWZEIG | W25M02GWZEIG-TR |
|---|---|---|
| Merek | Winbond | Winbond |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | Serial NAND Flash (SLC) | Non-Volatile NAND Flash (SLC) |
| Density | 2 Gbit (2 x 1 Gbit stacked die) | 2 Gbit (256 MB) - 2 x 1 Gbit die stacked |
| Architecture | Multi-Chip Package (MCP), two W25N01GW die | — |
| Supply Voltage VCC | 1.7 V to 1.95 V (1.8 V typ) | — |
| Antaramuka | Standard SPI, Dual SPI, Quad SPI | — |
| Frekuensi Klock Maksimum | 104 MHz | — |
| Page Size | 2048 bytes + 64 bytes spare | 2048 bytes + 64 bytes spare area |
| Block Size | 64 pages (131,072 bytes) | 128 KB (64 pages) |
| Endurance | 100,000 program/erase cycles per block | — |
| Data Retention | 10 years typical | 10 years typical |
| Internal ECC | Configurable, up to 8-bit per 512-byte sector | — |
| Suhu Operasi | -40 C to +85 C (industrial) | -40C to +85C (Industrial) |
| Kemasan | WSON-8 (8x6 mm) with exposed pad | 8-WSON (ZE) 8x6 mm |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Aras MSL | MSL3 (per JEDEC J-STD-020) | 3 (168 hours) |
| Status RoHS | Compliant (ROHS3) | Compliant |
| Boson Bebas | Yes | — |
| Memory Interface | — | SPI - Single, Dual, Quad I/O |
| Supply Voltage (VCC) | — | 1.7 V to 1.95 V (1.8 V typ.) |
| Maximum SPI Clock | — | 104 MHz |
| Access Time | — | 8 ns |
| Program/Erase Endurance | — | 100,000 cycles per block |
| Packaging | — | Tape & Reel (TR) |