XC3S200A-4FTG256I vs XC3S200-4FTG256I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci XC3S200A-4FTG256I disebabkan oleh Xilinx dan XC3S200-4FTG256I disebabkan oleh Xilinx. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Xilinx
XC3S200A-4FTG256I - 200K Gate Spartan-3A FPGA, 195 I/O | AMD/Xilinx
XC3S200A-4FTG256I ✓ Aktif
Pengandingan Spesifikasi
| Parametr | XC3S200A-4FTG256I | XC3S200-4FTG256I |
|---|---|---|
| Merek | Xilinx | Xilinx |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Spartan-3A | Spartan-3 |
| System Gates | 200,000 | 200,000 |
| Logic Cells | 4,032 | 4,320 |
| Configurable Logic Blocks (CLBs) | 448 | — |
| Slices | 1,792 | 2,160 |
| Distributed RAM | 48 Kbits | — |
| Block RAM | 288 Kbits | 216 Kbit (12 blocks x 18 Kbit) |
| User I/Os | 195 | — |
| Maximum Operating Frequency | 667 MHz | — |
| Speed Grade | -4 | -4 |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Multipliers (18x18) | 16 dedicated | — |
| DCMs | 4 | — |
| Kemasan | 256-ball FTBGA (FTG256), 17x17 mm, 1.0 mm pitch | 256-ball FTBGA (FTG256), 17 x 17 mm |
| Suhu Operasi | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Status RoHS | Lead-free / RoHS compliant | Compliant (G suffix = lead-free) |
| Dedicated Multipliers | — | 4 (18x18) |
| DCM (Digital Clock Manager) | — | 4 |
| Maximum User I/O | — | 173 |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Terminal Form | — | Ball |
| Peak Reflow Time | — | 30 s |