XC3S200A-4FTG256I vs XC3S200-4FTG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XC3S200A-4FTG256I sa pamamagitan ng Xilinx at XC3S200-4FTG256I sa pamamagitan ng Xilinx. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Xilinx
XC3S200A-4FTG256I - 200K Gate Spartan-3A FPGA, 195 I/O | AMD/Xilinx
XC3S200A-4FTG256I ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | XC3S200A-4FTG256I | XC3S200-4FTG256I |
|---|---|---|
| Brand | Xilinx | Xilinx |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Spartan-3A | Spartan-3 |
| System Gates | 200,000 | 200,000 |
| Logic Cells | 4,032 | 4,320 |
| Configurable Logic Blocks (CLBs) | 448 | — |
| Slices | 1,792 | 2,160 |
| Distributed RAM | 48 Kbits | — |
| Block RAM | 288 Kbits | 216 Kbit (12 blocks x 18 Kbit) |
| User I/Os | 195 | — |
| Maximum Operating Frequency | 667 MHz | — |
| Speed Grade | -4 | -4 |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Multipliers (18x18) | 16 dedicated | — |
| DCMs | 4 | — |
| Packhaging | 256-ball FTBGA (FTG256), 17x17 mm, 1.0 mm pitch | 256-ball FTBGA (FTG256), 17 x 17 mm |
| Temperature na Operasyon | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Tindminan RoHS | Lead-free / RoHS compliant | Compliant (G suffix = lead-free) |
| Dedicated Multipliers | — | 4 (18x18) |
| DCM (Digital Clock Manager) | — | 4 |
| Maximum User I/O | — | 173 |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Terminal Form | — | Ball |
| Peak Reflow Time | — | 30 s |