10AX066K2F40I1SG - Arria 10 GX 660K LE FPGA, 1517-BGA | Intel
MPN: 10AX066K2F40I1SG β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4080 | $40,800.00 |
| 100 | $3825 | $382,500.00 |
| 500 | $3605 | $1,802,500.00 |
| 1,000 | $3395 | $3,395,000.00 |
Drop-in alternatives for 10AX066K2F40I1SG β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX066K2F40I2SG
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10AX066K2F40E1SG
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10AX066K3F40I1SG
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10AX066K1F40I1SG
β Drop-Inβ In Stock
$2820 / Unit
View Datasheet β10AX066K2F40I1SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LE) | 660,000 |
| Embedded Memory Bits | 49,610,752 (approx. 49.6 Mbit) |
| User I/O Count | 696 |
| Package | 1517-BBGA, FCBGA (Flip-Chip BGA) |
| Package Size | 40 mm x 40 mm |
| Process Technology | 20 nm |
| Transceiver Data Rate (max) | 17.4 Gbps |
| Hard Memory Controller | Yes (DDR3/DDR4, QDR IV, RLDRAM 3) |
| PCIe Hard IP | PCI Express Gen3 x8 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore |
| DSP Blocks | Hardened floating-point DSP blocks |
| DSP Performance | Up to 1.5 TFLOPs (floating point) |
| Configuration Modes | AS, PS, JTAG, FPP |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (per manufacturer) |
10AX066K2F40I1SG 40 mm x 40 mm Pin Configuration Guide
Complete pinout information for 10AX066K2F40I1SG (40 mm x 40 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX066K2F40I1SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX066K2F40I1SG is suitable for 6 applications: Radar and Electronic Warfare DSP, ASIC Prototyping, 100G/400G Optical Transport Networking, Broadcast Video Infrastructure, High-End Test and Measurement, Military and Aerospace Communications.
Radar and Electronic Warfare DSP
The 10AX066K2F40I1SG is well-matched to radar and electronic warfare signal-processing designs because its hardened floating-point DSP blocks deliver up to 1.5 TFLOPs of throughput, as documented in the Intel Arria 10 device overview. The 660K logic elements support wide pulse-compression and beamforming pipelines, while the 17.4 Gbps transceivers accept multi-channel JESD204B/C data from RF ADCs. Industrial temperature grade (-40C to +100C) tolerates airborne and naval platform environments. Designers should pair the device with external DDR4 for radar data buffering and use Quartus Prime DSP Builder for floating-point IP cores.
Recommended
ASIC Prototyping
Engineers building ASIC prototypes for mid-to-large designs benefit from the 10AX066K2F40I1SG's 660K logic elements and 49.6 Mbit embedded memory, which support partitioning of multi-million-gate ASIC netlists. The 1517-ball FCBGA exposes 696 user I/O plus dozens of high-speed SERDES channels, simplifying in-target ASIC bring-up at near-real-time clock rates. Compared with older generation FPGAs, the Arria 10's 20 nm process reduces dynamic power, which is critical when prototyping power-aware ASIC IP. Use the Quartus Prime Pro Edition to leverage incremental compile and partial reconfiguration to shorten iteration cycles.
Recommended
100G/400G Optical Transport Networking
The 10AX066K2F40I1SG is suitable for OTN and packet-optical transport platforms thanks to its 17.4 Gbps transceivers, which can be aggregated to drive 100G and 400G Ethernet MAC and FEC pipelines. The 696 user I/O count supports multiple QSFP28 cages, while the hard PCIe Gen3 x8 IP enables direct host CPU connectivity for line-card designs. Per the Intel Arria 10 transceiver specification, these channels support both OTU4 and 100GBASE-R physical interfaces with built-in Adaptive Equalization. Industrial temperature grade ensures deployment in central office and outdoor plant cabinets.
Recommended
Broadcast Video Infrastructure
The 10AX066K2F40I1SG supports broadcast video routers, multiviewers, and IP-based SDI gateways because its 660K logic elements handle multi-channel 4K/UHD processing pipelines with margin. Its transceiver IP supports 12G-SDI, IP-based SMPTE ST 2110, and AES67 audio over IP standards. The 1517-BGA package exposes sufficient LVDS I/O for legacy SDI matrix switching, while the integrated ARM Cortex-A9 hard processor system handles control-plane stack tasks. Quartus Prime's video and image processing suite provides ready-made IP for color space conversion and frame-rate conversion.
Recommended
High-End Test and Measurement
The 10AX066K2F40I1SG fits high-end oscilloscopes, spectrum analyzers, and arbitrary waveform generators by combining 17.4 Gbps transceivers with 696 user I/O and 49.6 Mbit embedded memory for sample buffering. The hardened DSP blocks accelerate FFT and digital down-conversion math that is central to spectrum analysis, while the PCI Express Gen3 hard IP connects the FPGA to host CPUs for real-time data upload. Per the Arria 10 family datasheet, this device supports precise LVDS timing interfaces needed for time-domain instrumentation. Quartus Prime Signal Tap enables live logic analyzer debug during product development.
Recommended
Military and Aerospace Communications
The 10AX066K2F40I1SG is viable for secure military radios, satellite baseband processing, and avionics data buses due to its 660K logic elements and 17.4 Gbps SERDES channels. The industrial temperature grade (-40C to +100C) and RoHS compliance support many defense platforms, while the hard ARM Cortex-A9 subsystem handles secure boot and control-plane tasks. Per Intel's Arria 10 documentation, the 20 nm process provides radiation-tolerant design margins for non-geostationary orbit applications. Pair the FPGA with external cryptographic accelerators and watchdog supervisors for full mission assurance.
Recommended
Recommended Products Summary
Engineering reference data for 10AX066K2F40I1SG β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX066K2F40I2SG | 10AX066K2F40E1SG | 10AX066K3F40I1SG | 10AX066K1F40I1SG |
|---|---|---|---|---|---|
| Package | 1517-BGA FCBGA (40x40 mm) | 1517-BGA FCBGA - same | 1517-BGA FCBGA - same | 1517-BGA FCBGA - same | 1517-BGA FCBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Speed Grade | -2 (mid) | -2 (mid) | -1 (slow) | -3 (fast) | -1 (slow) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Extended | Industrial | Industrial |
| Embedded Memory | 49,610,752 bits | 49,610,752 bits | 49,610,752 bits | 49,610,752 bits | 49,610,752 bits |
| User I/O | 696 | 696 | 696 | 696 | 696 |
| Transceiver Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
Key Differentiators
- Mid-tier speed grade -2 balances Fmax margin and power (vs 10AX066K3F40I1SG)
- Industrial temperature grade suits harsh-environment deployment (vs 10AX066K2F40E1SG)
- Full 660K LE density at the 1517-BGA flagship package (vs 10AX048 family devices)
Design Notes
Estimated: The 1517-ball FCBGA at 40 mm x 40 mm requires a high-density PCB stack-up of at least 12 layers with HDI (microvia) technology. Use a 1.0 mm ball pitch and stagger the breakout vias to route all signals out of the inner BGA array. Decoupling should follow the Intel Arria 10 pin connection guidelines: bulk 22 uF/47 uF ceramic capacitors near power pins, and high-frequency 100 nF X7R capacitors within 1 mm of each power/ground pair. This decoupling topology maintains the transceiver power-supply noise below 1 percent, which is essential for 17.4 Gbps signal integrity.
Estimate: Length-match all 17.4 Gbps SERDES lanes within 0.127 mm (5 mil) to satisfy the Arria 10 transceiver skew tolerance. Use an 8-layer stripline stack-up with reference planes on layers 2 and 7. For DDR3/DDR4 interfaces to external memory, follow the Intel External Memory Interface (EMIF) Toolkit's pin-out guidance and add on-die termination (ODT) calibration in software. Avoid right-angle bends on any high-speed lane; use curved or 45-degree routing to minimize impedance discontinuities.
Estimated: The 10AX066K2F40I1SG may dissipate 15-25 W typical depending on transceiver utilization and DSP usage. The 1517-BGA package exposes a thermal pad that must be soldered to a continuous copper pour on the top layer and stitched through thermal vias (typically 0.3 mm pitch, 25 vias minimum) to inner ground planes. A heatsink with thermal interface material is recommended for enclosed chassis applications, and airflow of 200 LFM keeps junction temperature within the 100C industrial limit. Always run Intel's PowerPlay power analyzer within Quartus Prime before committing to a thermal solution.
Estimated: Do not skip the configuration time-out reset in firmware; the 10AX066K2F40I1SG's hard processor system requires a properly-sequenced reset of nCONFIG, nSTATUS, and CONF_DONE signals to enter user mode reliably. Power-up sequencing must respect the Intel Arria 10 power management guidelines: bring up VCCINT first, then VCCR, then VCCIO, with the enable ramp following the datasheet monotonicity rules. Failing to sequence correctly can latch the device into an unrecoverable configuration state requiring power cycling.
Compliance Information
RoHS compliant per manufacturer product page and Jotrin listing. AEC-Q100 not applicable - this is an FPGA, not an automotive analog/power device. Conflict-minerals compliance per Intel's annual CF Disclosure.
