H5ANAG4NBJR-VKC - 16Gb DDR4 SDRAM FBGA-78 | SK hynix
MPN: H5ANAG4NBJR-VKC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $19.75 | $19.75 |
| 10 | $18.2 | $182.00 |
| 100 | $16.9 | $1,690.00 |
| 500 | $15.6 | $7,800.00 |
| 1,000 | $14.4 | $14,400.00 |
Drop-in alternatives for H5ANAG4NBJR-VKC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →H5ANAG4NBJR-VKC Maximum Ratings & Electrical Characteristics
| Product Type | DDR4 SDRAM |
| Density | 16 Gb |
| Package | FBGA-78 (7.5 mm x 11 mm) |
| Operating Temperature Range | -40 C to +95 C (case, industrial with auto self-refresh) |
| Speed Grade | VKC (commercial speed bin - see SK hynix part number decoder) |
| Data Mask Function | Yes |
| Asynchronous Reset | Yes |
| Dynamic ODT | Yes |
| ZQ Calibration | Yes |
| Write Leveling | Yes |
| CRC / CA Parity | Yes |
| Auto Self-Refresh | Yes |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (per distributor listing) |
H5ANAG4NBJR-VKC fbga-78 (7.5 mm x 11 mm) Pin Configuration Guide
Complete pinout information for H5ANAG4NBJR-VKC (fbga-78 (7.5 mm x 11 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5ANAG4NBJR-VKC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5ANAG4NBJR-VKC is suitable for 6 applications: Server Memory Modules (RDIMM/LRDIMM), Industrial Computing and Factory Automation, Networking and Telecom Line Cards, Embedded Compute Modules (COM Express / SMARC), Test and Measurement Data Buffering, Surveillance and Video Analytics Systems.
Server Memory Modules (RDIMM/LRDIMM)
Server platforms require the highest available DRAM density per module slot, and the H5ANAG4NBJR-VKC's 16Gb single-die capacity allows 16 GB per 8-deep module rank with fewer components than multi-die solutions. SK hynix DDR4 parts use 8n prefetch and bank-group architecture to sustain high bandwidth across many parallel chips on a fly-by command/address topology, which is why write leveling and CRC support in this device are essential for module-level signal integrity. Placed on registered DIMMs, the DRAM operates behind a register/PLL chip (such as SPD/Register combos) that buffers CA bus loading; the dynamic ODT feature then matches impedance as ranks are added or removed. Thermal design is the main constraint: memory ranks share airflow, so the -40 C to +85 C industrial spec range with auto self-refresh adds margin for hot-aisle datacenter conditions.
Recommended
Industrial Computing and Factory Automation
Industrial PCs, PLC head units, and edge gateways operate in environments where ambient temperature swings from sub-zero warehouses to hot control cabinets. The H5ANAG4NBJR family's documented -40 C to +95 C case temperature range with auto self-refresh lets a single DRAM selection cover both extremes without heater circuits. SK hynix DDR4 documentation specifies that all DRAM specifications are maintained at case temperatures from -40 C to +85 C, with extended operation to +95 C, which maps directly to conduction-cooled industrial designs. The asynchronous reset function allows the host CPU to rapidly clear the DRAM state after a watchdog event, while the data mask function supports partial-word updates common in PLC data tables. Memory-down designs benefit from the compact FBGA-78 footprint for vibration-resistant, connector-free assembly.
Recommended
Networking and Telecom Line Cards
Network processors, switching ASICs, and telecom DSPs use DDR4 SDRAM as packet buffer and flow-table memory, where sustained bandwidth and deterministic refresh behavior matter more than peak latency. The H5ANAG4NBJR-VKC's x4 organization enables wide multi-chip interleaving on 72-bit ECC buses (18 chips per rank), improving effective bandwidth through bank-group interleaving. CRC and CA parity protection on the command/address bus, supported by this device, guard against soft errors in electrically noisy chassis environments - a documented NBJR family feature. Outdoor telecom cabinets drive the temperature requirement: the -40 C to +85 C industrial specification with extension to +95 C case covers uncooled deployments. Dynamic ODT simplifies multi-rank memory-down topologies by allowing the controller to change termination strength on the fly without board changes.
Recommended
Embedded Compute Modules (COM Express / SMARC)
Computer-on-module vendors embed DDR4 memory-down on COM Express and SMARC carriers where every square millimeter counts. The FBGA-78 (7.5 x 11 mm) package of the H5ANAG4NBJR-VKC provides 16Gb in one of the smallest DDR4 footprints available, allowing 4 GB per chip pair and 8 GB systems within a small module area. Because DDR4 reduces operating voltage relative to DDR3 by roughly 20% for equivalent bandwidth per SK hynix, module thermal budgets remain feasible under passive heatsinks. The ZQ calibration and write leveling functions automate impedance and timing compensation during boot, simplifying BIOS memory-training across component speed bins and vendors. Designers should route length-matched DQ/DQS fly-by CA topology and reserve the RZQ precision resistor placement per the SK hynix device operation document to guarantee training success.
Recommended
Test and Measurement Data Buffering
Oscilloscope, logic analyzer, and RF signal-capture platforms stream high-rate ADC data into deep DDR4 buffers. The H5ANAG4NBJR-VKC's bank-group architecture allows interleaved burst transfers that sustain the sustained write throughput required for gapless capture at converter rates. The data mask function lets the acquisition engine skip filling unused sample windows without full-burst rewrites, improving effective buffer utilization. Because bench instruments run in climate-controlled rooms, the commercial VKC speed grade is the economical choice, though the same-package -PBC industrial variant is available if the design is later ported to field equipment. Wide x4 organization enables deep interleaving across many chips on a 288-bit acquisition bus; designers must size decoupling and termination to DDR4 specs, since buffer write bursts load the power rail heavily and dynamically.
Recommended
Surveillance and Video Analytics Systems
AI-enabled NVRs and smart-camera hubs use DDR4 as working memory for multi-stream video decode plus neural inference frame buffers. The H5ANAG4NBJR-VKC provides 16Gb per chip, letting a 16-camera analytics appliance reach 8 GB with four components, conserving PCB area in 1U chassis. The asynchronous reset and auto self-refresh features support reliable operation around power events common in surveillance installations, while CRC-protected command/address signaling maintains integrity inside densely populated encoder boards. Temperature range is a differentiator: edge cabinets without active cooling can exceed +85 C internally, and the documented -40 C to +95 C case capability of the NBJR industrial range covers this scenario. Designers should verify controller support for dynamic ODT rank switching when mixing buffered and non-buffered topologies in compact encoder hardware.
Recommended
Recommended Products Summary
Engineering reference data for H5ANAG4NBJR-VKC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5ANAG4NBJR-UHC | H5ANAG4NBJR-RDC | H5ANAG4NBJR-PBC | H5ANAG6NBJR-VKC | H5ANAG8NBJR-VKC |
|---|---|---|---|---|---|---|
| Package | FBGA-78 (7.5 x 11 mm) | FBGA-78 (7.5 x 11 mm) - same | FBGA-78 (7.5 x 11 mm) - same | FBGA-78 (7.5 x 11 mm) - same | FBGA-78 (7.5 x 11 mm) - same | FBGA-78 (7.5 x 11 mm) - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density | 16 Gb | 16 Gb | 16 Gb | 16 Gb | 16 Gb | 16 Gb |
| Organization | x4 | x4 | x4 | x4 | x8 | x16 |
| Interface | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM |
| Temperature Range | -40 C to +95 C case (per family spec; suffix-dependent) | [DATA_NEEDED] | [DATA_NEEDED] | -40 C to +95 C (industrial grade) | -40 C to +95 C (per family data) | -40 C to +95 C (per family data) |
| Speed Bin (suffix decode) | VKC | UHC | RDC | PBC | VKC | VKC |
| Feature Set (DM / Reset / ODT / ZQ / Write Leveling / CRC) | All supported | All supported (NBJR family) | All supported (NBJR family) | All supported (NBJR family) | All supported (NBJR family) | All supported (NBJR family) |
| Approx. Unit Price (qty 1) | $19.75 (as of 2026-09-05, LCSC family reference) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- 16Gb single-die density (vs H5AN8G4NAFR-VKC)
- Industrial temperature option in same footprint (vs H5ANAG4NBJR-PBC)
- x4 organization for maximum ECC-bus interleave (vs H5ANAG8NBJR-VKC)
Design Notes
DDR4 uses a fly-by command/address/clock topology: CA and clock signals see staggered arrival times at each DRAM, which the controller must compensate via write leveling - a function the H5ANAG4NBJR-VKC supports natively. Route length-matched DQ/DQS groups per byte lane, and terminate CA with on-die termination rather than external resistor networks. Enable ZQ calibration with the precision RZQ resistor (typically 240 ohm per DDR4 convention - confirm exact value in the SK hynix datasheet) placed close to the ZQ ball with a solid ground return. Skipping or mis-tuning calibration is the leading cause of memory-training failures at speed.
Per SK hynix DDR4 documentation, all DRAM specifications are supported with case temperature maintained between -40 C and +85 C, with extended operation allowed between +85 C and +95 C case temperature. In fanless or sealed enclosures, model case temperature - not ambient - using theta_JC-style conduction paths through the BGA balls to the PCB; a memory-down design on a 4-layer board relies on copper planes as the primary heat spreader. Above +85 C, auto self-refresh maintains data integrity, but refresh overhead (and thus effective bandwidth) increases, so verify your throughput margin in extended-temperature operation.
Suffix codes matter: SK hynix part numbers encode speed bin and temperature grade in the suffix (VKC, UHC, RDC, PBC), and the same package hosts x4/x8/x16 organizations (AG4/AG6/AG8). Ordering the wrong suffix or organization yields a part that physically fits the footprint but fails to meet timing or bus-width requirements. Always verify the exact suffix with the SK hynix part number decoder (available on the SK hynix Downloads portal) before releasing the BOM, and treat second-source qualification as a board-level exercise requiring ball-map and timing comparison.
Compliance Information
RoHS compliance indicated by distributor listing context for the NBJR family (which is described as lead-free and halogen-free in historical family documentation); exact REACH, lead-free, and halogen-free status for the -VKC suffix should be confirmed against the SK hynix product compliance database.
