10M16DAF484I7P - MAX 10 FPGA, 16K LE, 484-BGA | Intel / Altera
MPN: 10M16DAF484I7P ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.1 | $721.00 |
| 100 | $64.4 | $6,440.00 |
| 250 | $58.2 | $14,550.00 |
| 500 | $53.05 | $26,525.00 |
Drop-in alternatives for 10M16DAF484I7P — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M16DAF484I7G
✅ Drop-In✓ In Stock
$60.4 / Unit
View Datasheet →10M16DAF484C7G
✅ Drop-In✓ In Stock
$55.5 / Unit
View Datasheet →10M16DAF484A7G
✅ Drop-In✓ In Stock
$12.1 / Unit
View Datasheet →10M08DAF484I7P
✅ Drop-In✓ In Stock
$22.1 / Unit
View Datasheet →10M16DAF484I7P Maximum Ratings & Electrical Characteristics
| Product Line | MAX 10 FPGA |
| Device Logic Elements | 16,000 LE |
| Adaptive Logic Modules (ALMs) | 320 ALM |
| Embedded Memory | 549 kbit (M9K blocks) |
| Maximum User I/Os | 320 I/O |
| Package | 484-ball FBGA (F484) |
| Operating Supply Voltage (Core) | 1.2 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Style | SMD/SMT |
| DSP Blocks (18x18 Multipliers) | 45 |
| Configuration Type | Non-volatile (internal flash) |
| Integrated ADC | Dual 12-bit, up to 1 MSPS |
| PLLs | 4 user PLLs |
| MSL Level | 3 |
| RoHS Status | Compliant |
10M16DAF484I7P 484-ball fbga (f484) Pin Configuration Guide
Complete pinout information for 10M16DAF484I7P (484-ball fbga (f484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16DAF484I7P.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16DAF484I7P is suitable for 6 applications: Industrial Motor Control and PLC, Video Bridge and Display Controller, Automotive Driver-Assistance Subsystem, Factory Automation I/O Expansion, Portable Test and Measurement, Low-Cost ASIC Prototyping.
Industrial Motor Control and PLC
The 10M16DAF484I7P's 16K logic elements, 45 18x18 hardware multipliers, and dual 1 MSPS 12-bit ADCs make it well-suited to closed-loop field-oriented control (FOC) of three-phase PMSM and induction motors. The device drives multiple PWM channels concurrently, samples motor phase currents via the integrated ADC, and executes the FOC transform in hardware with deterministic latency. The industrial -40C to +100C temperature range covers factory-floor enclosures without derating. With 549 kbit embedded SRAM the soft-position-loop fits on-chip, removing external memory from the BOM. The 320 I/Os accept quadrature encoders, Hall sensors, and CAN/RS485 transceivers simultaneously. Quoted as of 2026-09-05 the part provides higher LE density than the 10M08 family at the same 484-FBGA footprint.
Recommended
Video Bridge and Display Controller
With 16,000 logic elements and 45 dedicated 18x18 multipliers the 10M16DAF484I7P runs real-time format conversion between parallel RGB, LVDS, and MIPI-style interfaces without visible latency. The 549 kbit of block RAM holds frame buffers up to 320x240 at 16 bpp, removing external SRAM in cost-sensitive designs. 320 user I/Os support 24-bit parallel video plus sync, plus a secondary touch-panel interface. Designers can integrate alpha blending, color-space conversion, and on-screen overlay within a single FPGA. Quartus Prime reference designs for HDMI-to-LVDS bridges target this exact device. The 484-FBGA exposes enough balls for dual-display outputs. Real-world deployments include industrial HMI panels and digital signage repeaters.
Recommended
Automotive Driver-Assistance Subsystem
The 10M16DAF484I7P industrial grade operates across -40C to +100C, supporting ADAS sensor fusion nodes mounted behind the bumper. When AEC-Q100 qualification is required, designers migrate to the 10M16DAF484A7G automotive variant which shares the same die and 484-FBGA footprint. The integrated dual ADC samples up to 12 bits at 1 MSPS, ideal for ultrasonic-park-assist echo capture and battery-monitoring channels. 16K LE perform sensor-fusion DSP and CAN-FD message filtering concurrently. 320 I/Os accept multiple CSI-style camera lanes plus CAN/LIN transceivers. The non-volatile flash allows instant-on within 10 ms after power-up, critical for rear-camera wake-up. Pin-compatible migration to AEC-Q100 is a single OPN change.
Recommended
Factory Automation I/O Expansion
Programmable logic controllers (PLCs) and remote I/O blocks use the 10M16DAF484I7P to implement 32+ channels of isolated digital input debouncing, pulse counting, and PWM output generation in a single chip. The 320 user I/Os comfortably accommodate Profibus, RS-485, Ethernet, and discrete I/O without external muxing. 549 kbit of block memory buffers high-speed event logs locally. The integrated ADC reads 4-20 mA analog inputs for process-control loops. Industrial temperature grade -40C to +100C supports cabinet-free mounting on the factory floor. The non-volatile MAX 10 configuration ensures deterministic boot for safety PLCs requiring IEC 61131-3 compliance.
Recommended
Portable Test and Measurement
Handheld oscilloscopes, logic analyzers, and protocol testers use the 10M16DAF484I7P for capture buffering and triggering. The 549 kbit embedded memory stores pre-trigger samples and decodes I2C, SPI, UART, and CAN-FD frames in real time. 16K LE implement hardware decoders for parallel buses up to 32 bits wide. Dual ADCs at 1 MSPS handle analog front-end sampling for entry-level scopes. Industrial temperature grade supports outdoor field-service use cases. The instant-on flash configuration eliminates boot delays at customer sites. USB and Ethernet MAC IP cores from Quartus Prime fit comfortably within the 16K LE budget.
Recommended
Low-Cost ASIC Prototyping
Engineers validate ASIC RTL on the 10M16DAF484I7P before committing to mask costs, leveraging 16K LE for medium-complexity SoC prototypes and 45 multipliers for DSP pre-silicon verification. The 484-FBGA exposes 320 I/Os to connect to real-world peripherals and DDR3 memory for early software bring-up. Non-volatile configuration allows rapid board-spin iteration - designers reprogram via JTAG in seconds. Quartus Prime supports the same synthesis flow used for Cyclone V and Cyclone 10 LP families, easing downstream migration. The industrial temperature grade enables prototype validation in target environments.
Recommended
Recommended Products Summary
Engineering reference data for 10M16DAF484I7P — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16DAF484I7G | 10M16DAF484C7G | 10M16DAF484A7G | 10M08DAF484I7P |
|---|---|---|---|---|---|
| Package | 484-FBGA (F484) | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 16,000 LE | 16,000 LE | 16,000 LE | 16,000 LE | 8,000 LE (-50%) |
| Embedded Memory | 549 kbit | 549 kbit | 549 kbit | 549 kbit | 378 kbit (-31%) |
| User I/Os | 320 | 320 | 320 | 320 | 250 (-22%) |
| 18x18 Multipliers | 45 | 45 | 45 | 45 | 24 (-47%) |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Automotive -40C to +125C (AEC-Q100) | Industrial -40C to +100C |
| Configuration Type | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash |
Key Differentiators
- Highest-density 10M16 die with 16K LE and 549 kbit memory (vs 10M08DAF484I7P)
- Industrial temperature grade I7 with -40C to +100C operation (vs 10M16DAF484C7G)
- AEC-Q100 migration path to 10M16DAF484A7G (vs 10M16DAF484I7G)
Design Notes
Estimated: at 50% toggle rate and 25C ambient, the 10M16DAF484I7P core draws roughly 0.8-1.2 A from the 1.2 V supply, while the 2.5 V/3.3 V I/O banks can add another 0.3 A. Use a 3% tolerance LDO such as Intel Enpirion EM2130 or a switching regulator with output ripple below 30 mV pk-pk. Decouple each VCCINT pin with a 0.1 uF X7R plus a 10 uF bulk; place 0.1 uF within 1 mm of each ball. Separately filter VCCA (analog PLL/ADC supply) from VCCD to avoid digital switching noise coupling into the ADC reference.
The 484-FBGA uses 1.0 mm ball pitch and requires microvia or HDI PCB stack-up with 4-6 routing layers. Match all DDR3/LPDDR2 traces within +/-25 mil length, route address/control in matched groups, and provide proper 50 ohm single-ended or 100 ohm differential impedance. Expose a thermal pad array under the package to inner ground planes for heat spreading; at 1.5 W dissipation the junction-to-ambient rise is approximately 15-20 C with proper copper. Recommended footprint per IPC-7351 FBGA-484 1.0 mm pitch.
Do not leave the nCONFIG, nSTATUS, or MSEL pins floating - tie MSEL[3:0] to GND/3.3 V to select FPP-x16 or AS-x4 configuration mode per MAX 10 handbook Table 8-1. The CONF_DONE pin requires a 5 kohm pull-up to 3.3 V. For JTAG boundary-scan, connect TCK with a 1 kohm pull-down and TMS with a 10 kohm pull-up. Failing to follow MSEL rules is the most common cause of 'device not detected' issues during programming.
Compliance Information
Pb-free and RoHS compliant per Altera/Intel product page. Industrial-grade I7 part is NOT AEC-Q100 qualified; choose 10M16DAF484A7G automotive variant for that certification.
